Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/? C.; and an adhesive layer, including polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300? C. The adhesive tape according to the technical solution of the present invention can effectively avoid problems such as chip tilt, packaging material flash, contamination caused by an adhesive residue, lead frame warpage, and the like during back-end packaging of a semiconductor device.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.

The present disclosure relates to the field of display, in particular to a composite cover film and a flexible display device. The composite cover film comprises a polyimide layer, and a first hard coating and a first transparent optical adhesive layer disposed on two sides of the polyimide layer, respectively, wherein at least one of the first hard coating and the first transparent optical adhesive layer contains a nanoscale colorant. The present disclosure further relates to a flexible display device comprising a flexible display panel and the composite cover film disposed on a light-exiting side of the flexible display panel.

A tape has a substrate layer and a pressure-sensitive adhesive layer on one surface of the substrate layer, and has an elongation at break of 100% or more and an elastic modulus of 2 GPa or less. The tape has, after having heated at 230? ? C. for 80 seconds, an elongation at break of 100% or more and the elastic modulus of 2 GPa or less.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces. the materials are particularly useful in bonding together dissimilar substrates.

The present disclosure relates to a flexible panel and the manufacturing method thereof. The method includes: coating photosensitive adhesive on a substrate to form a photosensitive layer; forming a scattering layer and an ultraviolet (UV) blocking layer on the photosensitive layer in sequence; forming a flexible substrate layer on the UV blocking layer; forming electronic components, lighting components, and an encapsulation layer on the flexible substrate layer in sequence; and irradiating the photosensitive layer from one side of the substrate by UV rays such that a peeling strength of the photosensitive layer being reduced, and the scattering layer being separated from the substrate to form the flexible panel. By configuring the photosensitive layer, the scattering layer, and the UV blocking layer on the substrate, the scattering layer may be easily separated from the substrate.

A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).

The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0V1)/V0]100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

A pressure-sensitive adhesive sheet (X1), which is a pressure-sensitive adhesive sheet for build stage use according to the present invention, has a multilayer structure typically including a substrate (11) and a pressure-sensitive adhesive layer (12). The pressure-sensitive adhesive sheet (X1) has a puncture strength of 3.3 to 12 N, where the puncture strength is determined as a maximum load during a process in which a probe having a hemispherical head with the radius of curvature of 0.5 mm pierces the pressure-sensitive adhesive sheet at a travel speed of 0.2 mm/s. The pressure-sensitive adhesive sheet for build stage use is suitable for detachment of an object, which is formed on a build stage typically of an additive manufacturing apparatus, from the build stage while less causing the significant damage to the object.