Patent classifications
C09J2479/086
Support film, OLED display structure and manufacturing method thereof
The present disclosure discloses a support film, an OLED display structure and a manufacturing method thereof. The support film includes a first adhesive material layer and a first base material layer, which are stacked together, and a first release film therebetween.
COATING MATERIAL, COATING FILM, LAYERED PRODUCT, AND FLEXIBLE FLAT CABLE
Disclosed is a coating material comprising 100 parts by mass of an acid-modified polypropylene (A) and at least 450 parts by mass of organic solvents (B), wherein the acid-modified polypropylene has a melting point of 90? C. or lower and the organic solvents (B) comprises 80-99 mass % aromatic hydrocarbon solvent (B1) and 20-1 mass % one or more solvents (B2) selected from the group consisting of ester-based solvents, ketone-based solvents, and alcohol-based solvents, the sum of the proportion of the ingredient (B1) and the proportion of the ingredient (B2) being 100 mass %. The coating material may further contain a compound (C) having, in the molecule, two or more functional groups capable of forming a chemical bond with a carboxyl group, in an amount of 0.1-20 parts by mass. The compound (C) having, in the molecule, two or more functional groups capable of forming a chemical bond with a carboxyl group may be one having no hydrolyzable group. Also disclosed are: a coating film formed from the coating material; a layered product comprising the coating film and a substrate film; and a flexible flat cable including the layered product.
STRETCH RELEASING ADHESIVE ASSEMBLY, HOUSING ASSEMBLY AND MOBILE TERMINAL
The present disclosure provides a stretch releasing adhesive assembly, a housing assembly, and a mobile terminal. The stretch releasing adhesive assembly includes: a stretch releasing adhesive layer, having a pull portion at an end of the stretch releasing adhesive layer; and a first pull layer, the first pull layer and the pull portion being superposed and connected, the first pull layer being provided with at least one tear line in a position corresponding to the pull portion.
Adhesive tape for connecting secondary battery electrodes
Disclosed herein is an adhesive tape for connecting secondary battery electrodes which prevents an adhesive from leaking to electrodes during electrode processing processes even though the adhesive tape for connecting the electrodes is adhered or which prevents the adhesive from leaking to the electrodes wound near the adhesive tape in a case that the electrode substrates are wound in a roll type in order to continuously connect electrode substrates of the front and rear ends during a secondary battery electrode manufacturing process, thereby preventing the electrodes from being damaged and from being unacceptable. The adhesive tape for connecting secondary battery electrodes comprises: a base film formed in a thin plate type and made of a synthetic resin; and an adhesive layer formed on the lower surface of the base film by applying an adhesive to the central portion of the base film, except the left and right peripheries.
Poly(amic acid) composition and polyimide composition
There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3,4,4-biphenyltetracarboxylic acid dianhydride.
RESIN FILM, LAMINATE, OPTICAL MEMBER, GAS BARRIER MATERIAL AND TOUCH SENSOR SUBSTRATE
A resin film 10 comprising a polyimide-based polymer is disclosed. The resin film 10 has a tensile elastic modulus of 4.0 GPa or more. In a bending test where the resin film 10 is repeatedly folded into a U-shape until the distance between the resin film faces opposed to each other reaches 3 mm, and unfolded, the number of times of folding the resin film 10 until the resin film 10 fractures is more than 100000.
NONAQUEOUS ELECTROLYTE SECONDARY BATTERY
A nonaqueous electrolyte secondary battery includes an insulating tape which covers at least a portion of an exposed portion of a current collector, together with at least a portion of a lead. The insulating tape has a substrate layer and a first adhesive layer, and the substrate layer has a first organic layer and a second organic layer interposed between the first organic layer and the first adhesive layer. The elastic modulus E1 of the first organic layer is lower than the elastic modulus E2 of the second organic layer.
POLYESTER-ISOCYANATE COATINGS AND LABELS INCLUDING THE SAME
Polyester-isocyanate coatings that exhibit desirable heat resistance and adhesion to a variety of polymeric materials and labels including such coatings are provided. The polyester-isocyanate compounds present within the coatings can be obtained by reacting an isocyanate and a hydroxylated polyester. The coatings may be applied to labels and have reduced curling tendency while having improved thermal transfer printability, heat resistance, chemical resistance, scratch resistance, and wave soldering resistance.
FLEXIBLE ELECTRONIC CIRCUITS WITH EMBEDDED INTEGRATED CIRCUIT DIE AND METHODS OF MAKING AND USING THE SAME
Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.
LAMINATE FILM FOR TEMPORARY BONDING, METHODS FOR PRODUCING SUBSTRATE WORKPIECE AND LAMINATE SUBSTRATE WORKPIECE USING THE LAMINATE FILM FOR TEMPORARY BONDING, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME
The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.