C09J2479/086

OPTICAL ADHESIVE TAPE AND DISPLAY PANEL

Disclosed by embodiments of the present application are an optical adhesive tape and a display panel. The optical adhesive tape includes a first buffer layer and an opening disposed at a position corresponding to the fingerprint identification area and configured to penetrate the first buffer layer. The opening is filled with a removable filler including a second buffer layer.

SUPPORT FILM, OLED DISPLAY STRUCTURE AND MANUFACTURING METHOD THEREOF
20220340787 · 2022-10-27 ·

The present disclosure discloses a support film, an OLED display structure and a manufacturing method thereof The support film includes a first adhesive material layer and a first base material layer, which are stacked together, and a first release film therebetween.

ADHESIVE TAPE FOR SEMICONDUCTOR PACKAGE MANUFACTURING PROCESS AND METHOD FOR MANUFACTURING SAME

The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20220319873 · 2022-10-06 ·

A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 μm or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 μm or more.

Battery and method of manufacturing battery

A battery (2) comprising a pressure sensitive adhesive sheet (1) and an electrolyte solution, wherein: the pressure sensitive adhesive sheet is provided at a site in the battery in which there is a possibility of contact with the electrolyte solution; the pressure sensitive adhesive sheet comprises a base material (11) and a pressure sensitive adhesive layer (13) laminated at one side of the base material; and the pressure sensitive adhesive layer (13) is formed of a pressure sensitive adhesive composition comprising: a (meth)acrylic ester polymer having a main chain containing (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 6 or more and 20 or less, and carboxy group-containing monomer units, wherein the (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 6 or more and 20 or less contain 2-ethylhexyl (meth)acrylates and (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 10 or more and 20 or less.

DECORATIVE GRILL DECAL AND METHOD OF USE
20170360256 · 2017-12-21 ·

A decorative decal for altering the aesthetics of a barbeque grill, with the decal comprising a flexible and heat resistant substrate having a visually discernible aesthetic element on its first surface and an adhesive on its second surface, with the adhesive suitable for attaching the substrate to the outer surface of the barbeque grill; and a method of use of the decal.

Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

RFID bead label devices capable of withstanding and maintaining RFID operability for identification purposes during and post-vulcanization of rubber articles

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

Protective Film, Protective Film Assembly, Display Assembly, and Terminal
20230174826 · 2023-06-08 ·

A protective film includes an adhesive layer and a base film layer that are stacked. The adhesive layer is configured to adhere to a foldable display. The base film layer includes one or more layers of high-modulus base film and one or more layers of low-modulus base film. An elastic modulus of the high-modulus base film is greater than an elastic modulus of the low-modulus base film. The high-modulus base film and the low-modulus base film are alternately stacked. A surface layer in the base film layer and non-adjacent to the adhesive layer is the high-modulus base film. The protective film is configured to be firmly attached to the foldable display, resists rebounding and warping when the display is bent, and protects the foldable display.

Adhesive film and method for manufacturing semiconductor device

An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.