The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.

Aerogels comprising a hydrophobic polyimide moiety, including hydrophobic polyimide aerogels, as well as methods of manufacture and applications thereof, are generally described.

A temporary protective film for semiconductor encapsulation molding, the temporary protective film including a support film, an adhesive layer provided on one surface of the support film, and a non-adhesive layer provided on a surface of the support film on an opposite side from the surface provided with the adhesive layer. The thickness of the non-adhesive layer is 10 m or less. A surface of the non-adhesive layer on an opposite side of a surface in contact with the support film, has a surface roughness Ra of 0.1 m or more.

Provided is a pressure-sensitive adhesive sheet for temporarily fixing an electronic part that shows peelability by irradiation with light, the pressure-sensitive adhesive sheet for temporarily fixing an electronic part having a wide range of selection of the light to be applied. The pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a laminated structure A including a first photothermal conversion layer and a second photothermal conversion layer arranged on at least one side of the first photothermal conversion layer; and a pressure-sensitive adhesive layer arranged on at least one side of the laminated structure A. The pressure-sensitive adhesive sheet has a transmittance for light having a wavelength of 1,032 nm of 75% or less, and has a transmittance for light having a wavelength of 355 nm of 50% or less.

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130 C. and for 2 hours at 170 C., the film obtains an elastic modulus of 350 to 550 MPa at 25 C.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.

A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23 C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100 C. or higher and 420 C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3,4,4-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4-diamino-2,2-dimethylbiphenyl residue.

A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed on the backing film layer, and a transparent acrylic adhesive layer disposed on the electrically conductive transparent layer. The adhesive tape has heat resistivity and antistatic performance on an adhesive side of the tape while maintaining good optical transparency.

An adhesive film including a first polymer comprising a first (meth)acrylate resin and at least one type of monomer represented by Chemical Formula 1; and a second polymer comprising a second (meth)acrylate resin. Also disclosed are a method for manufacturing the adhesive film and a foldable display device comprising the adhesive film.