An embodiment of the present invention provides a separator for a non-aqueous secondary battery containing a porous substrate; a heat-resistant porous layer that is provided on one side or on both sides of the porous substrate, and that contains a binder resin and inorganic particles, the inorganic particles having an average primary particle diameter from 0.01 μm to less than 0.45 μm; and an adhesive layer that is provided on one side or on both sides of a laminated body of the porous substrate and the heat-resistant porous layer, and adhesive resin particles adhered to the laminated body.

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue is A.sub.1 mol %, the content ratio of the 4,4′-oxydiphthalic anhydride residue is A.sub.2 mol %, the content ratio of the p-phenylenediamine residue is B.sub.1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B.sub.2 mol %, the relationships of A.sub.1+A.sub.2≥80, B.sub.1+B.sub.2≥80 and (A.sub.1+B.sub.1)/(A.sub.2+B.sub.2)≤3.50 are satisfied.

A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue.

A recording paper includes: a laminated resin film including a substrate composed of a thermoplastic resin film and an underlayer disposed on at least one side of the substrate and composed of a thermoplastic resin composition; and a resin coating disposed facing the underlayer of the laminated resin film, wherein the underlayer has an indentation modulus of 50 to 1200 MPa, the resin coating contains a resin that is a reaction product of a cationic water-soluble polymer and a silane coupling agent, a content of a silane coupling agent component is 15 to 60 parts by mass with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating, the resin coating is free from thermoplastic resin particles, and a content of an inorganic filler is 9 parts by mass or less with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating.

The present application relates to an adhesive film comprising a first polymer comprising a first (meth)acrylate resin and at least one type of a monomer of the following Chemical Formula 1, a method for manufacturing the same, and a foldable display device comprising the same:

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An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.