Patent classifications
C
C09
C09K
3/00
C09K3/10
C09K3/1025
C09K3/1025
HEAT EXPANDABLE FOAM
A composition for an expandable sealant including at least one polymeric material selected from the group consisting of low density polyethylenes (LDPE), linear low density polyethylenes (LLPDE), ethylene vinyl acetate (EVA), ethylene methacrylate (EMA), and ethylene-butyl acrylate (EnBA); and a chemical blowing agent, wherein the composition is substantially free of a cross-linking agent.
Liquid resin composition for sealing and electronic component apparatus
12131970
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2024-10-29
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A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.