Patent classifications
C09K3/1409
ABRASIVE ARTICLES AND METHODS FOR FORMING SAME
An abrasive article can include a body including a first portion coupled to a second portion in a radial plane. The body can include a central opening extending in an axial direction of the body through the first portion and through the second portion. The central opening can include a circumferential surface defining an inner diameter of the body. The circumferential surface can be defined by at least a portion of the first portion and at least a portion of the second portion. The first portion can include first abrasive particles contained within a first bond material, including an inorganic material, and the second portion can include second abrasive particles contained within a second bond material, including an organic material. The organic material can include epoxy. In an embodiment, the second portion comprises an elongation-at-fracture of less than 2.7%, a Stiffness Value of at least 8.3, or a combination thereof.
PARTICULATE SLURRIES AND METHODS OF MAKING THE SAME
The present disclosure provides a method of making a chemical mechanical planarization slurry. The method includes contacting a chemical mechanical planarization slurry precursor including a carrier and a plurality of abrasive particles with a semi-permeable fiber membrane. Upon contact, the method further includes separating the chemical mechanical planarization slurry precursor into a concentrate and an effluent. The concentrate includes the chemical mechanical planarization slurry and the effluent includes the carrier and a plurality of particles. The particles of the effluent have a median size that is less than a median size of the abrasive particles of the concentrate. In the method a pressure difference measured between an inlet to which the chemical mechanical planarization slurry precursor is supplied and a first outlet to which the effluent is supplied is in a range of from about 1 psi to about 15 psi.
Systems and methods for making abrasive articles
In methods and systems of making an abrasive article, abrasive particles are loaded to a distribution tool including a plurality of upper walls defining a plurality of spacing slots, and a plurality of lower walls defining a plurality of distribution slots. The spacing slots are open to the distribution slots, which are open to a lower side of the tool. The loaded particles are spaced and distributed from the distribution tool to a major face of a backing web below the lower side and moving relative to the tool in a machine direction. The upper walls space the particles in the machine direction. The particles distributed by the lower walls undergo an orientation sequence in which each particle is oriented into a column aligned along the machine direction. The upper walls can be disposed oblique to the lower walls. The upper and lower walls can have pointed upper portions.
Shaped abrasive particles, methods of making, and abrasive articles including the same
A method of making abrasive particles includes: providing a slurry comprising non-colloidal solid particles and a liquid vehicle; forming at least a portion of the slurry into shaped bodies contacting a substrate; at least partially drying the shaped bodies to provide shaped abrasive precursor particles; separating at least a portion of the shaped abrasive precursor particles from the substrate; and converting at least a portion of the shaped abrasive precursor particles into shaped abrasive particles. The shaped abrasive particles comprise alpha alumina having an average crystal grain size of 0.8 to 8 microns and an apparent density that is at least 92 percent of the true density. Each shaped abrasive particle has a respective surface comprising a plurality of smooth sides that form at least four vertexes. Shaped abrasive particles, abrasive articles including them, and methods of using are also disclosed.
SHAPED ABRASIVE PARTICLES WITH CONCAVE VOID WITHIN ONE OF THE PLURALITY OF EDGES
A shaped abrasive particle is presented. The shaped abrasive particle has a first and second surface. The first and second surfaces are substantially parallel to each other and separated by a thickness. Each of the first and second surfaces have a surface profile, which includes a plurality of corners and a plurality of edges connecting the plurality of corners. The shaped abrasive particle also includes a recess included wholly within one of the plurality of edges, wherein the recess is a concave void extending into the surface profile. The shaped abrasive particle also includes a magnetically responsive coating. The magnetically responsive coating causes the shaped abrasive particle to be responsive to a magnetic field. The shaped abrasive particle, when exposed to the magnetic field, experiences a net torque that causes the shaped abrasive particle to orient with respect to the magnetic field such that each of the first and second surfaces are substantially perpendicular to a backing.
Polishing composition based on mixture of colloidal silica particles
Provided herein are compositions comprising a first colloidal silica particle that is not surface-modified and a second colloidal silica particle that is surface modified to carry a negative charge. Also provided herein are methods for selectively removing HfO.sub.2 or SiO.sub.2 from a surface.
COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING AND CHEMICAL-MECHANICAL POLISHING METHOD
Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well as reducing surface defects after polishing. The composition for chemical-mechanical polishing contains (A) silica particles having a functional group represented by general formula (1) and (B) a silane compound. —COO-M+ . . . (1) (M+ represents a monovalent cation.)
Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate
The present invention provides, in polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, means that is capable of improving a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials. The present invention relates to a polishing composition used for polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, the polishing composition containing: organic acid-immobilized silica; a dispersing medium; a selection ratio improver that improves a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials; and an acid, in which the selection ratio improver is organopolysiloxane having a hydrophilic group.
ABRASIVE PARTICLE INCLUDING COATING, ABRASIVE ARTICLE INCLUDING THE ABRASIVE PARTICLES, AND METHOD OF FORMING
An abrasive particle can include a coating overlying at least a portion of a core. In an embodiment, the coating can include a first portion overlying at least a portion of the core and a second portion overlying at least a portion of the core, wherein the first portion can include a ceramic material and the second portion can include a silane or a silane reaction product. In a particular embodiment, the first portion can consist essentially of silica. In another particular embodiment, the first portion can include a surface roughness of not greater than 5 nm and a crystalline content of not greater than 60%.
METHOD FOR MAKING AGGLOMERATE PARTICLES
The invention provides agglomerate particles, made by a process comprising: (a) forming by mixing at high speed a slurry of mineral agglomerate components in a polymerizable liquid resin carrier; (b) mixing said slurry with a non-miscible fluid to form discrete dispersed droplets; (c) exposing the discrete dispersed droplets to UVA radiation; (c) solidifying said droplets to form a multitude of solid particles; (d) isolating said solid particles and then firing said particles. The resulting size of the fired particles of the invention are estimated to be in the range from approximately 20 μm to approximately 500 μm.