A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, the second particles contain a cerium compound, and in a case where a content of the abrasive grains is 2.0% by mass, a BET specific surface area of a solid phase obtained when the slurry is subjected to centrifugal separation for 30 minutes at a centrifugal acceleration of 1.1×10.sup.4 G is 24 m.sup.2/g or more.

Various shaped abrasive particles are disclosed. Each shaped abrasive particle includes a body having at least one major surface and a side surface extending from the major surface.

A method for manufacturing microfibrillated cellulose, a particulate grinding medium suitable for use in said method, a material which wears rough, and a method for making said particulate grinding medium.

A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, and a liquid medium, in which a zeta potential of the abrasive grains is positive, and the hydroxy acid has one carboxyl group and one to three hydroxyl groups.

An abrasive article with a bonded abrasive body having a ratio of diameter to thickness of at least 10:1. The abrasive article can include secondary abrasive particles contained in a bond material, wherein the secondary abrasive particles include agglomerated primary abrasive particles.

One aspect of the present invention provides a polishing method including polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part.

There is provided a production method of a chain silica particle dispersion. This production method includes a dispersion preparation step of hydrolyzing alkoxysilane in the presence of ammonia to prepare a silica particle dispersion, an ammonia removal step of removing the ammonia from the silica particle dispersion such that an ammonia amount relative to silica contained in the silica particle dispersion is 0.3% by mass or less, and a hydrothermal treatment step of hydrothermally treating the silica particle dispersion having a silica concentration of 12% by mass or more, from which the ammonia has been removed, at a temperature of not lower than 150° C. and lower than 250° C. An abrasive including such chain silica particles is high in polishing rate and excellent in polishing properties.

A method of processing a workpiece with a disk-shaped blade containing abrasive grains includes the steps of placing an auxiliary plate made of a material having a modulus of elasticity higher than a material of which a front surface side of the workpiece is made, on the front surface side of the workpiece, causing the blade rotated to cut into the front surface side of the workpiece to cut the workpiece as well as the auxiliary plate, and removing the auxiliary plate from the workpiece that has been cut by the blade.

[Technical Problem]To provide diamond grits with enhanced friability, and method for the production comprising in combination internal microcracks within the diamond particle and surface irregularities, with or without a layer of non-diamond carbon covering the particle surface.

[Solution to Problem]

The diamond grits of the invention consist of diamond particles synthesized by a static ultrahigh pressure-high temperature process, comprising both microcracks generated within the particles due to the effect of heating, and surface irregularities formed on the particles by oxidizing etching at elevated temperatures.

The production method comprises providing a starting volume of diamond particles, from a synthesizing process in a static ultrahigh pressure-high temperature process, subjecting said diamond particles to a heating process in intimate contact with an oxidizing etchant at a temperature of 800° C. or higher, generating thus microcracks within the diamond particles and also causing to corrode the particle surface thus forming increased surface irregularities, and recovering the treated diamond particles.

An aqueous alkaline chemical mechanical polishing composition includes a quaternary ammonium compound having a phenyl group which enables enhanced reduction of defects on silicon oxide substrates and enables good silicon oxide removal rates during chemical mechanical polishing.