Patent classifications
C09K3/1436
Slurry and polishing method
A slurry containing abrasive grains, a liquid medium, and a salt of a compound represented by formula (1) below, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, and the second particles contain a hydroxide of a tetravalent metal element. ##STR00001##
[In formula (1), R represents a hydroxyl group or a monovalent organic group].
High Oxide Film Removal Rate Shallow Trench (STI) Chemical Mechanical Planarization (CMP) Polishing
High oxide film removal rate Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods, and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic oxide particles, such as ceria-coated silica; and a chemical additive for providing a high oxide film removal rate. The chemical additive is a gelatin molecule possessing negative and positive charges on the same molecule.
SURFACE-MODIFIED COLLOIDAL SILICA AND POLISHING COMPOSITION CONTAINING THE SAME
The surface-modified colloidal silica according to an aspect of the present invention contains colloidal silica, and a surface-modifying group for modifying a surface of the colloidal silica, which has a polyoxyalkylene chain having a weight average molecular weight of 20,000 or more.
ABRASIVE ARTICLES AND METHODS FOR FORMING SAME
An abrasive article can include a body including agglomerated first abrasive particles and unagglomerated second abrasive particles contained in a bond material. The first abrasive particles can include chromium oxide. The second abrasive particles can be elongated. The bond material can include an inorganic material including a vitreous phase.
Method of treating a surface, surface-modified abrasive particles, and resin-bond abrasive articles
An adhesion promoter comprises a reaction product of: a) a polyepoxide; b) an aminosilane represented by the formula HNR.sup.1R.sup.2. R.sup.1 and R.sup.2 independently represent —Z—SiL.sub.3. Each Z independently represents a divalent linking group having from 1 to 12 carbon atoms, and each L independently represents a hydrolyzable group; and c) an isocyanatosilane represented by the formula O═C═N—Z—SiL.sub.3, wherein Z and L are as previously defined. The adhesion promoter may be used to treat a surface of a substrate such as an abrasive particle, which may be included in a resin-bond abrasive article.
METHOD AND APPARATUS FOR PRODUCING ENDLESS ABRASIVE ARTICLES AND A PRODUCED ABRASIVE ARTICLE
A method for producing endless abrasive articles (100) includes providing a mandrel coil (200), which comprises a first complete turn (B0.sub.A) formed of an endless mandrel belt (B0), feeding the endless mandrel belt (B0) to an input end (IN0) of the mandrel coil (200) and unwinding the mandrel belt (B0) from an output end (OUT0) of the mandrel coil (200) so as to move the surface of the first complete turn (B0.sub.A) of the mandrel coil (200), forming a laminated sleeve (SLEEVE1) by feeding a first strip (S1) on the moving surface of the first complete turn (B0.sub.A) of the mandrel coil (200), and forming an endless abrasive article (100) by cutting the laminated sleeve (SLEEVE1).
SHAPED ABRASIVE PARTICLES
A mold for making abrasive particles is presented. The mold includes a surface and a plurality of cavities extending downward from the surface. Each cavity includes a particle shape portion comprising a polygonal shape and a fracture portion coupled to the particle shape portion. The fracture portion is configured to break from the particle shape portion during a stress event, resulting in a fractured shape abrasive particle.
Oxide chemical mechanical planarization (CMP) polishing compositions
The present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic metal oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the first group of non-ionic organic molecules multi hydroxyl functional groups in the same molecule; chemical additives selected from the second group of aromatic organic molecules with sulfonic acid group or sulfonate salt functional groups and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
Intermediate raw material, and polishing composition and composition for surface treatment using the same
An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
ABRASIVE ARTICLES AND METHODS FOR FORMING SAME
An abrasive article can include a body including a first portion coupled to a second portion in a radial plane. The body can include a central opening extending in an axial direction of the body through the first portion and through the second portion. The central opening can include a circumferential surface defining an inner diameter of the body. The circumferential surface can be defined by at least a portion of the first portion and at least a portion of the second portion. The first portion can include first abrasive particles contained within a first bond material, including an inorganic material, and the second portion can include second abrasive particles contained within a second bond material, including an organic material. The organic material can include epoxy. In an embodiment, the second portion comprises an elongation-at-fracture of less than 2.7%, a Stiffness Value of at least 8.3, or a combination thereof.