Provided is a sound-absorbing material, including an adsorbent material and a thermal conductive material. The thermal conductive material is uniformly dispersed in the sound-absorbing material. The thermal conductive material includes a carbon fiber material, and a weight ratio of the carbon fiber material in the sound-absorbing material is within a range of 0.05% to 10%. Further provided are a preparation method of the sound-absorbing material and a speaker using the sound-absorbing material. The sound-absorbing material has higher thermal conductivity and can be added to a rear cavity of the speaker to effectively conduct heat generated when the speaker is working, thereby improving the heat dissipation performance of the speaker.

A polymer including VDF-based units having an electrocaloric effect under the effect of a variable electric field. The polymer includes 0.1 to 10.0 mol % double bonds, which are substantially non-conjugated. Also, a corresponding composition including the polymer, a corresponding film including the polymer, and to various uses of the polymer.

A polymer including VDF-based units having an electrocaloric effect under the effect of a variable electric field. The polymer includes 0.1 to 10.0 mol % double bonds, which are substantially non-conjugated. Also, a corresponding composition including the polymer, a corresponding film including the polymer, and to various uses of the polymer.

A copolymerized polycarbonate resin having, at least, a constituent unit (A) and a constituent unit (B). The constituent unit (A) is derived from a dihydroxy compound. The carbonate constituent unit (B) is derived from a polyoxyalkylene glycol. A weight ratio of the constituent unit (B) derived from a polyoxyalkylene glycol to a weight of the copolymerized polycarbonate resin is preferably more than 20 wt % and 99 wt % or less.

A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

The present invention aims to provide a urethane resin and a heat dissipation component each having excellent thermal conductivity and excellent flexibility. The present invention relates to a curable composition containing: a polyol (A); a polyisocyanate (B); at least one dispersant (C) for inorganic fillers selected from the group consisting of a phosphate ester (C1), a C12-C24 fatty acid (C2), a sucrose fatty acid ester (C3), a sorbitan fatty acid ester (C4), and a glycerol fatty acid ester (C5); and an inorganic filler (D), the curable composition satisfying the following requirements (1) to (3) that (1) the polyol (A) contains a polyalkylene glycol (A1) having a chemical formula weight or number average molecular weight of 1000 or less in an amount of 50% by weight or more based on the weight of the polyol (A); (2) the inorganic filler (D) is contained in an amount of 70 to 97% by weight based on the weight of the curable composition; and (3) the total weight of the dispersant (C) for inorganic fillers is 1 to 5 parts by weight per 100 parts by weight of the inorganic filler (D), the phosphate ester (C1) being represented by the following formula (1):

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Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa.Math.s or more and 2,000 mPa.Math.s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.