Compounds for inhibiting corrosion are provided that include a pyridinium substituent and a hydroxy substituent. Also provided are methods of making the compounds. Also provided are corrosion inhibitor formulations including the compounds. Also provided are processes for inhibiting corrosion of a metallic surface using the corrosion inhibitor formulations.

Compounds for inhibiting corrosion are provided that include a pyridinium substituent and a hydroxy substituent. Also provided are methods of making the compounds. Also provided are corrosion inhibitor formulations including the compounds. Also provided are processes for inhibiting corrosion of a metallic surface using the corrosion inhibitor formulations.

A treated zinc pigment that provides cathodic corrosion protection in aqueous zinc-rich coatings is described. The treated zinc pigment shows reduced gas generation in aqueous formulation.

A treated zinc pigment that provides cathodic corrosion protection in aqueous zinc-rich coatings is described. The treated zinc pigment shows reduced gas generation in aqueous formulation.

Compounds for inhibiting corrosion are provided that include a pyridinium substituent and a hydroxy substituent. Also provided are methods of making the compounds. Also provided are corrosion inhibitor formulations including the compounds. Also provided are processes for inhibiting corrosion of a metallic surface using the corrosion inhibitor formulations.

Compounds for inhibiting corrosion are provided that include a pyridinium substituent and a hydroxy substituent. Also provided are methods of making the compounds. Also provided are corrosion inhibitor formulations including the compounds. Also provided are processes for inhibiting corrosion of a metallic surface using the corrosion inhibitor formulations.

A singlet oxygen scavenger includes, as an active component, hexyl diethyl amino hydroxy benzoyl benzoate, 1-(4-methoxy phenyl)-3-(4-tert-butyl phenyl)-1, 3-propanedione, terephthalylidene-3, 3′-dicamphor-10, 10′-disulfonate, 2-ethyl hexyl 4-methoxy cinnamate, or 2-ethyl hexyl 2-cyano-3, 3-diphenyl acrylate; or 2-phenyl benzimidazole-5-sulfonic acid, 4, 4′, 4″-[(1, 3, 5-triazine-2, 4, 6-triyl) tris (imino)] trisbenzoic acid tris (2-ethyl hexyl), octyl salicylate, or 3, 3, 5-trimethyl cyclohexyl salicylate; or 2-hydroxy-4-methoxy-5-(sodiooxysulfonyl) benzophenone, drometrizol trisiloxane, 2-hydroxy-4-methoxy benzophenone, or 4-methyl benzylidene camphor.

A singlet oxygen scavenger includes, as an active component, hexyl diethyl amino hydroxy benzoyl benzoate, 1-(4-methoxy phenyl)-3-(4-tert-butyl phenyl)-1, 3-propanedione, terephthalylidene-3, 3′-dicamphor-10, 10′-disulfonate, 2-ethyl hexyl 4-methoxy cinnamate, or 2-ethyl hexyl 2-cyano-3, 3-diphenyl acrylate; or 2-phenyl benzimidazole-5-sulfonic acid, 4, 4′, 4″-[(1, 3, 5-triazine-2, 4, 6-triyl) tris (imino)] trisbenzoic acid tris (2-ethyl hexyl), octyl salicylate, or 3, 3, 5-trimethyl cyclohexyl salicylate; or 2-hydroxy-4-methoxy-5-(sodiooxysulfonyl) benzophenone, drometrizol trisiloxane, 2-hydroxy-4-methoxy benzophenone, or 4-methyl benzylidene camphor.

A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a hard mask removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a hard mask removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.