A powder coating material including a main material resin containing an epoxy resin; a phosphorus flame retarder; and at least one inorganic particulate substance selected from metal hydroxides and hydrous metal compounds. The inorganic particulate substance has an average particle size of 0.01 to 9 μm. The inorganic particulate substance is present in an amount of 80 to 200 parts by mass relative to 100 parts by mass of the main material resin.

A powder coating material including a main material resin containing an epoxy resin; a phosphorus flame retarder; and at least one inorganic particulate substance selected from metal hydroxides and hydrous metal compounds. The inorganic particulate substance has an average particle size of 0.01 to 9 μm. The inorganic particulate substance is present in an amount of 80 to 200 parts by mass relative to 100 parts by mass of the main material resin.

Low-scorch flame-retardant polyurethane foams include phosphorus-containing propionic ester flame retardants. Methods for producing and using the foams are also provided.

Low-scorch flame-retardant polyurethane foams include phosphorus-containing propionic ester flame retardants. Methods for producing and using the foams are also provided.

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

A composition comprising a heat transfer portion and a lubricating portion, wherein the lubricating portion comprises one or more compounds according to formula (I) of the present disclosure, wherein W is H; Y is independently selected from the group consisting of F, Cl, Br and I; Z is independently selected from the group consisting of H, OH, (CW.sub.2).sub.PCW.sub.3, CY.sub.3, OCW.sub.3, O(CW.sub.2).sub.pCW.sub.3, OCW((CY.sub.2).sub.mCY.sub.3)CWCW.sub.2, polyalkylene glycol and polyolester; n is an integer from 2 to 250; m is an integer from 0 to 3; and p is an integer from 0 to 9.

A composition comprising a heat transfer portion and a lubricating portion, wherein the lubricating portion comprises one or more compounds according to formula (I) of the present disclosure, wherein W is H; Y is independently selected from the group consisting of F, Cl, Br and I; Z is independently selected from the group consisting of H, OH, (CW.sub.2).sub.PCW.sub.3, CY.sub.3, OCW.sub.3, O(CW.sub.2).sub.pCW.sub.3, OCW((CY.sub.2).sub.mCY.sub.3)CWCW.sub.2, polyalkylene glycol and polyolester; n is an integer from 2 to 250; m is an integer from 0 to 3; and p is an integer from 0 to 9.

The invention relates to the use of a silyl functional compound b), which silyl functional compound comprises a N—O—Si bond, for improving the flame retardant properties of a composition comprising an organic polymer a), which is one of a thermoplastic polymer or a thermoset polymer or a mixture thereof.

The invention relates to the use of a silyl functional compound b), which silyl functional compound comprises a N—O—Si bond, for improving the flame retardant properties of a composition comprising an organic polymer a), which is one of a thermoplastic polymer or a thermoset polymer or a mixture thereof.