A sealing material for sealing a light-emitting element, wherein: the sealing material has a bonding surface capable of being in contact with the light-emitting element; and the bonding surface has an arithmetic average roughness of 10 nm or more and 1,000 nm or less. The sealing material preferably has a storage elastic modulus at 90? C. of 10 MPa or more. The sealing material preferably contains a metal compound. A method for producing a light-emitting device, including the steps of: bonding a bonding surface of the sealing material to a light-emitting element; and bonding a barrier member to a surface of the sealing material on a side opposite to the bonding surface.

A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine. ##STR00001##

Provided is a rubber composition for sealing material which contains 100 parts by mass of a rubber component, 50 to 140 parts by mass of silica, 1 to 20 parts by mass of a silane coupling agent, and 15 to 35 parts by mass of carbon black. The rubber component is preferably an ethylene-propylene-diene rubber.