Patent classifications
C09K2323/051
LAMINATED FILM
Provided is a laminated film which is capable of preventing quantum dots from being deteriorated due to moisture or oxygen and therefore has high durability, and is capable of narrowing the frame and therefore has high productivity. More specifically, provided is a laminated film, including a functional layer laminate having an optical functional layer and a gas barrier layer laminated on at least one main surface of the optical functional layer, and an edge face sealing layer formed so as to cover at least a part of an edge face of the functional layer laminate, in which a surface roughness Ra of the edge face of the functional layer laminate in a formation region of the edge face sealing layer is 0.1 to 2 m and a thickness of the edge face sealing layer is 1 to 5 m.
Urea (multi)-(meth)acrylate (multi)-silane compositions and articles including the same
Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi) (meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making the urea (multi)-(meth)acrylate (multi)-silanes and their use in composite films and electronic devices are described.
Urea (multi)-(meth)acrylate (multi)-silane compositions and articles including the same
Urea (multi)-(meth)acrylate (multi)-silane precursor compounds, synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds, either neat or in a solvent, and optionally with a catalyst, such as a tin compound, to accelerate the reaction. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi) (meth)acrylate (multi)-silane precursor compound synthesized by reaction of (meth)acrylated materials having isocyanate functionality with aminosilane compounds. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making the urea (multi)-(meth)acrylate (multi)-silanes and their use in composite films and electronic devices are described.
Anti-reflective film, display panel and display device having the same, and fabricating method thereof
The present application discloses a method of fabricating an anti-reflective film, comprising forming a zinc oxynitride layer on a substrate; annealing the zinc oxynitride layer; and etching the surface of the zinc oxynitride layer with an etching solution to form a micro lenses layer comprising a plurality of micro lenses on surface.
UREA (MULTI)-URETHANE (METH)ACRYLATE-SILANE COMPOSITIONS AND ARTICLES INCLUDING THE SAME
Compositions of matter described as urea (multi)-urethane (meth)acrylate-silanes having the general formula R.sub.ANHC(O)N(R.sup.4)R.sup.11[OC(O)NHR.sub.S].sub.n, or R.sub.SNHC(O)N(R.sup.4)R.sup.11[OC(O)NHR.sub.A].sub.n. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-urethane (meth)acrylate-silane precursor compound. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making such urea (multi)-urethane (meth)acrylate-silane precursor compounds, and their use in composite films and electronic devices are also described. Methods of using multilayer composite films as barrier films in articles selected from solid state lighting devices, display devices, and photovoltaic devices are also described.
UREA (MULTI)-URETHANE (METH)ACRYLATE-SILANE COMPOSITIONS AND ARTICLES INCLUDING THE SAME
Compositions of matter described as urea (multi)-urethane (meth)acrylate-silanes having the general formula R.sub.ANHC(O)N(R.sup.4)R.sup.11[OC(O)NHR.sub.S].sub.n, or R.sub.SNHC(O)N(R.sup.4)R.sup.11[OC(O)NHR.sub.A].sub.n. Also described are articles including a substrate, a base (co)polymer layer on a major surface of the substrate, an oxide layer on the base (co)polymer layer; and a protective (co)polymer layer on the oxide layer, the protective (co)polymer layer including the reaction product of at least one urea (multi)-urethane (meth)acrylate-silane precursor compound. The substrate may be a (co)polymer film or an electronic device such as an organic light emitting device, electrophoretic light emitting device, liquid crystal display, thin film transistor, or combination thereof. Methods of making such urea (multi)-urethane (meth)acrylate-silane precursor compounds, and their use in composite films and electronic devices are also described. Methods of using multilayer composite films as barrier films in articles selected from solid state lighting devices, display devices, and photovoltaic devices are also described.
METHOD OF MANUFACTURING A DEVICE SUBSTRATE AND A DISPLAY DEVICE MANUFACTURED USING THE SAME
A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.
ANTI-REFLECTIVE FILM, DISPLAY PANEL AND DISPLAY DEVICE HAVING THE SAME, AND FABRICATING METHOD THEREOF
The present application discloses a method of fabricating an anti-reflective film, comprising forming a zinc oxynitride layer on a substrate; annealing the zinc oxynitride layer; and etching the surface of the zinc oxynitride layer with an etching solution to form a micro lenses layer comprising a plurality of micro lenses on surface.
Laminated roll of sealed graphite pouches and methods for making the same
Laminated rolls of sealed graphite pouches and methods for making the same are provided. The laminated roll can include a first substrate having a length and a plurality of sealed pouches disposed on the substrate at predetermined intervals along its length. Each sealed pouch can include a graphite sheet having first and second sides, the first side affixed to the substrate, and a second substrate affixed to at least the second side of the graphite sheet and to a portion of the substrate to fully seal the graphite sheet within an enclosed space. In one embodiment, the roll of sealed graphite sheet pouches can be fixed to a roll of another substrate in a roll-to-roll fashion and the combined rolls can be cut into discrete portions for use in a particular application. For example, the roll of the other substrate can be a roll of enhanced spectral reflector (ESR).
Method of manufacturing a device substrate and a display device manufactured using the same
A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.