Patent classifications
C11D3/0073
Dishwashing detergents containing a salicylidene-based chelant
The object of the present invention is to provide a detergent, especially a dishwashing detergent, with improved detergency. Detergent compositions having metal complexes with certain salicylidene ligands, which may be created in situ, solve this problem.
Composition for removing photoresist residue and/or polymer residue
To provide a composition for removing photoresist residue and/or polymer residue formed in a process for producing a semiconductor circuit element, and a removal method employing same. A composition for removing photoresist residue and/or polymer residue, the composition containing saccharin and water, and the pH being no greater than 9.7.
Cleaning compositions and methods for cleaning engine cooling systems
Cleaning compositions include (a) a carrier liquid; (b) a metal citrate and/or a plurality of reagents configured to generate the metal citrate in situ; (c) one or a plurality of non-ionic surfactants; and (d) an organophosphate hydrotrope configured to increase solubility of the one or the plurality of non-ionic surfactants in the carrier liquid. Methods for cleaning engine cooling systems are described.
Method, kit, and composition for corrosion removal
Methods, compositions, and kit(s) for removing corrosion or scale from a metal or a non-metal article are disclosed. In a first stage of the method, an article exhibiting corrosion can be exposed to an acid wash composition including a first acid component having one or more of HCl, Phosphoric Acid, Oxalic Acid, a second acid inhibitor/surfactant component including ethoxylated alkyl mercaptan, and a third thixotropic gelling agent component including Talc or Fumed silica, sufficient to cause gelling of the acid wash composition. In a second stage of the method performed subsequent to the first stage, the article can be exposed to an acid neutralizing composition comprising bicarbonate, borax, isopropyl alcohol and water.
Post CMP cleaning composition
The disclosure generally relates to a composition and process for cleaning residue and/or contaminants from microelectronic devices having said residue and contaminants thereon. The residue may include post-CMP, post-etch, and/or post-ash residue. The compositions and methods are particularly advantageous when cleaning a microelectronic surface comprising copper, low-k dielectric materials, and barrier materials comprising at least one of tantalum-containing material, cobalt-containing material, tantalum-containing, tungsten-containing, and ruthenium-containing material.
BIODEGRADABLE FORMULATION AND ITS USE AS A SUPERFICIES RESTORATIVE AGENT
The present invention provides a biodegradable formulation and its use as a surfaces restoring agent, said formulation allows a substantial savings when restoring the existing paint on different surfaces, since it mainly cleans and restores the surface or paint contaminated by the environment, damaged due to the sun and the processes of the different industries, in addition to being friendly to the environment, making it a useful technology in any industrial branch that involves cleaning and restoring large areas. It is worth noting that the modifications to the original formula were made to optimize the results in the different applications and improve its biodegradability.
Use of amino carboxylate for enhancing metal protection in alkaline detergents
The invention includes ware detergent compositions which prevent buildup of precipitates and also surprisingly provides significant metal protection of items exposed to alkaline detergent composition. According to the invention alkaline ware detergents may include an effective amount of amino carboxylate. Surprisingly, detergents which included amino carboxylate also provided significant metal protection against corrosion, even when traditional corrosion inhibiting components are reduced.
Composition for TiN hard mask removal and etch residue cleaning
Composition, method and system for TiN hard mask removal from electronic circuitry devices, such as advanced pattern wafers have been disclosed. The cleaning compositions preferably comprise an etchant agent (also referred to as a base), an oxidizing agent, an oxidizing stabilizer (also referred to as a chelating agent), an ammonium salt, a corrosion inhibitor, and a solvent. Other optional additives could be provided. It is preferable that the pH of the cleaning composition be greater than 5.5. The cleaning composition is preferably free from dimethyl sulfoxide and tetramethylammonium hydroxide.
CLEANING AGENT AND PREPARATION METHOD AND USE THEREOF
Provided are a cleaning agent and a preparation method and the use thereof. The cleaning agent is prepared from the following raw materials comprising the following mass fraction of components: 0.5%-20% of an oxidant containing iodine, 0.5%-20% of an etchant containing boron, 1%-50% of a pyrrolidinone solvent, 1%-20% of a corrosion inhibitor, 0.01%-5% of a metal ion-free surfactant, and water, with the sum of the mass fraction of each component being 100%, the pH of the cleaning agent is 7.5-13.5, and the corrosion inhibitor is one or more of a benzotriazole corrosion inhibitor, a hydrazone corrosion inhibitor, a carbazone corrosion inhibitor and a thiocarbohydrazone corrosion inhibitor. The cleaning agent can efficiently remove nitrides from hard mask residues with little effects on metals and low-K dielectric materials, and has a good selectivity.
MACROMOLECULAR CORROSION (MCIN) INHIBITORS: STRUCTURES, METHODS OF MAKING AND USING THE SAME
Disclosed are multifunctional compounds represented by structural formula (I):
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methods of producing compounds represented by structural formula (I) and their use in inhibiting corrosion in corrodible material.