C11D3/0084

LEUCO COLORANTS AS BLUING AGENTS IN LAUNDRY CARE COMPOSITIONS

A laundry care composition including at least one laundry care ingredient, a leuco composition, from 0.05 wt % to 15 wt % of a primary amine compound and from 0.005 wt % to 5 wt % of an antioxidant.

LAUNDRY CARE COMPOSITIONS AND METHODS FOR DETERMINING THEIR AGE

A laundry care composition including (a) at least one laundry care ingredient and (b) a leuco composition. The leuco composition has a first color state and a second color state and the mole ratio of second color state to first color state is from 2:98 to 5:95. Also disclosed are methods of determining the approximate functional age of a laundry care composition comprising the steps of (a) providing a laundry care composition that includes at least one laundry care ingredient and a leuco composition, (b) providing a functional age scale that includes a plurality of distinct colors that correspond to a unique functional age and (c) comparing the color of the laundry care composition with the functional age scale.

LEUCO COMPOUNDS AND COMPOSITIONS COMPRISING THE SAME

A laundry care composition including (a) at least one laundry care ingredient and (b) a leuco compound including an antioxidant moiety covalently bonded to a leuco moiety. A method of treating a textile comprises the steps of (a) providing such a laundry care composition; (b) adding the laundry care composition to a liquid medium; (c) placing textile articles in the liquid medium; (d) optionally, rinsing the textile; and (e) drying the textile articles

Leuco colorants as bluing agents in laundry care compositions

A laundry care composition including: (a) at least one laundry care ingredient and (b) a leuco composition. The laundry care composition has a ?HA of at least 10. Methods of treating textiles with such laundry care compositions.

PACKAGE FOR LAUNDRY SCENT ADDITIVE

A package for a particulate laundry scent additive.

Processing Composition of Improved Metal Interconnect Protection and The Use Thereof
20190048292 · 2019-02-14 ·

A semiconductor processing composition for removing residues and/or contaminants from substrate containing Cu, barrier metal and low-k dielectric. The processing composition includes at least one quaternary base, at least one organic amine, at least one surface modifier, at least one antioxidant, at least one complexing agent and balance water. The processing composition provides a sufficient corrosion protection to Cu and metal barrier during process queue time without deteriorating reliability of electronic devices.

Peroxide based multi-purpose cleaner, degreaser, sanitizer/virucide and associated solutions and methods for preparing the same
10119099 · 2018-11-06 · ·

A cleaning solution including: a primary solvent; a secondary solvent; an oxidizing agent, wherein the oxidizing agent includes a peroxide; a surfactant system, wherein the surfactant system includes a nonionic surfactant, a first anionic surfactant, and a second anionic surfactant; and an antioxidant, wherein the antioxidant is characterized by the structure of formula I: ##STR00001##
wherein R.sub.1-R.sub.6, are each independently selected from the group including H; OH; and an alkyl, cycloalkyl, polycycloalkyl, heterocycloalkyl, aryl, alkaryl, aralkyl, alkoxy, alkanoyl, aroyl, alkenyl, alkyl-alkenyl, alcohol, ether, ketone, carboxylic acid, acid halide, acid anhydride, ester, and/or amide group containing approximately 1 to approximately 25 carbon atom(s); wherein at least three of R.sub.1-R.sub.6 include OH; and wherein at least one of R.sub.1-R.sub.6 includes an ester.

LIQUID DETERGENTS OR CLEANING AGENTS CONTAINING ACYL HYDRAZONE AND REDUCING AGENTS
20180298309 · 2018-10-18 · ·

Improving the cleaning power of liquid detergents and cleaning agents in relation to stains. This is substantially achieved by incorporating a combination of a specific acyl hydrazone and reducing agents.

Cleaning composition following CMP and methods related thereto

The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains a bulky protecting ligand, an organic amine, an organic inhibitor, and water. The invention also provides methods for using the cleaning composition.