Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.

A laundry composition including a plurality of granules, where each of said granules has a longest dimension of no less than 3 mm and no more than 12 mm, and an aspect ratio of no more than 5, and each of said granules has a mass from 1 mg to 1 g; wherein said granules comprise 25% to 99.9% of a water soluble carrier by weight of the granules. The laundry composition also includes from 0.1% to 10% of a plurality of fine particles, by weight of the laundry composition, said fine particles having an average particle size of 0.05 μm to 50 μm.

A substrate or coating is provided that includes a protease with enzymatic activity toward a component of a biological stain. Also provided is a process for facilitating the removal of a biological stain is provided wherein an inventive substrate or coating including a protease is capable of enzymatically degrading of one or more components of the biological stain to facilitate biological stain removal from the substrate or said coating.

A substrate or coating is provided that includes a protease with enzymatic activity toward a component of a biological stain. Also provided is a process for facilitating the removal of a biological stain is provided wherein an inventive substrate or coating including a protease is capable of enzymatically degrading of one or more components of the biological stain to facilitate biological stain removal from the substrate or said coating.

The present composition relates to effervescing compositions used in the treatment of toilets, and in particular malodours which may emanate therefrom, as well as methods of making such compositions and methods of their use. The compositions may be in pulvurent form which may be a granular form, or may be in a solid form such as a tablet.

Cleaning and degreasing compositions containing a diutan gum thickener are provided for removing burnt on, polymerized, carbonized food soils with minimum manual effort. The compositions are ready to use compositions and beneficially remain on a treated surface for sufficient time to permit soil penetration without drying out. The compositions can be easily removed with minimal manual effort, such as use of low pressure water applied to the treated surface, and beneficially do not leave residues. Methods for cleaning and degreasing a surface with the compositions are also provided. Thickening systems employing the diutan gum and laponite clays are also provided.

Described herein is an automatic dishwashing (ADW) composition including as component (A) at least one imidazole-based compound selected from the group consisting of unsubstituted or at least monosubstituted imidazole and benzimidazole. The automatic dishwashing composition may include further components, such as polyakylene imines (component (B)), at least one silicate (component (C)) and/or at least one chelating agent (component (D)). Also described herein is a process for cleaning dishware using said ADW composition as well as a method of using said ADW composition, for example, to reduce any corrosion on the items to be dishwashed (dishware). Also described herein is a method of using at least one imidazole-based compound according to component (A) as a corrosion inhibitor in automatic dishwashing processes.

The disclosure provides compositions and methods for making a colorized solution of an aqueous disinfectant that is both stable in bulk solution and will fade to clear within a predetermined period of time after being applied to a surface, for example as a spray or film. The compositions and methods described here allow an end user to visualize both the extent of coverage and the duration of contact of the disinfectant with the surface, thereby providing more efficient disinfection of the surface.

Polishing compositions are disclosed for simultaneously removing particles from a surface that has been polished using a CMP slurry comprising a polishing rate accelerator and removing a pad stain from a polishing pad that has been contacted with a CMP slurry comprising a polishing rate accelerator.

Cleaning compositions for post-CMP cleaning of semiconductor surfaces, comprise one or more reducing agents, a particle removal agent, a surfactant, and a base. When one or more reducing agents yields a standard reduction potential of less than 1.224 V, the cleaning composition of the present disclosure is able to remove a MnO.sub.2 pad stain from a polishing pad and reduce defects on a polished surface (by removing particles).

Described herein are aqueous cleaning compositions comprises a combination of polyalkylenimine and an acid, a surfactant, and a solvent mixture. Methods of making and using the same are also described.