Patent classifications
C11D3/162
CLEANING COMPOSITION FOR INDUSTRIAL COATING LINE
1) Cleaning composition comprising: from 5% to 99% of a thermoplastic polymer which does not react with moisture (a), from 1% to 15% of a monofunctional silane compound (b); from 0% to 94% of a compound (c) chosen from a plasticizer (c1), an oil (c2) or a tackifying resin (c3); said composition being homogeneous and having a Brookfield viscosity, measured at 100 C., within the range extending from 20 to 200 000 mPa.Math.s.
2) Process for cleaning the walls of items of industrial equipment which are coated with a layer of composition C comprising a polymer P having alkoxysilane groups, said process comprising the mixing of said composition C with the cleaning composition according to 1).
Method for treating a semiconductor device
A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.
METHOD FOR TREATING A SEMICONDUCTOR DEVICE
A sensor array includes a plurality of sensors. A sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array. A method of treating the sensor array includes exposing at least the sensor pad to a wash solution including sulfonic acid and an organic solvent and rinsing the wash solution from the sensor pad.
Disinfectant material
A disinfectant material may be used to kill bacteria, viruses, mold and fungal contaminants while minimizing toxic risks to humans. The disinfectant material may be effective in killing pathogens and more on numerous types of surfaces including on the skin of mammals. Exemplary embodiments include a copper halogen, such as copper iodide. Exemplary materials may also include a pH stabilizer, a preservative, humectants, or other constituents. Exemplary disinfectant materials may be used as a liquid or a gel, applied via a wipe, sprayed or in other forms.
Wafer Washing Method, and Liquid Chemical Used in Same
To provide a water-repellent protective film-forming liquid chemical used in a process of cleaning a wafer by means of a cleaning machine whose liquid contact member contains a vinyl chloride resin. A liquid chemical is used, which includes an alkoxysilane represented by the following general formula [1]; at least one kind selected from the group consisting of a sulfonic acid represented by the following general formula [2], an anhydride of the sulfonic acid, a salt of the sulfonic acid and a sulfonic acid derivative represented by the following general formula [3]; and a diluent solvent containing at least one kind selected from the group consisting of a hydrocarbon, an ether and a thiol.
(R.sup.1).sub.aSi(H).sub.b(OR.sup.2).sub.4-a-b[1]
R.sup.3S(O).sub.2OH[2]
R.sup.3S(O).sub.2OSi(H).sub.3-c(R.sup.4).sub.c[3]
CLEANING COMPOSITION AND METHOD FOR ENHANCED SEALANT ADHESION
Methods comprising the steps of contacting a surface with a liquid composition comprising a cleaning agent, an adhesion promoter, and at least one dye, the surface having a first surface contamination; transitioning at least one portion of the surface in the first surface contamination state to a second surface contamination state and simultaneously distributing the at least one dye and at least one adhesion promoter on the surface associated with the second surface contamination state, the second surface contamination state having reduced or eliminated surface contamination, the transitioning step simultaneously cleaning and preparing the at least one portion of the surface for adhesion to another material; and identifying remaining surface in the first surface contamination state, and compositions adapted for the method thereof.
Composition for caring for keratin fibers and use thereof for cleansing and conditioning the keratin fibers
Composition for caring for keratin fibers and use thereof for cleansing and conditioning the keratin fibers, especially the hair, which includes A) a combination of an anionic surfactant and an amphoteric surfactant; B) at least one cationic polymer with a charge density greater than 4 meq/g; C) at least one aminated silicone; and D) at least one insoluble, non-aminated silicone.
SILICONE SURFACTANT, AND SILICONE-DISSOLVATIVE CLEANER CONTAINING THE SAME
Provided are: a novel compound that has excellent activity of dissolving a silicone compound and thereby solubilizing the silicone compound in an organic solvent; and a cleaner that contains the compound and can completely and rapidly remove the silicone compound deposited/remained on a mold and/or a molded article obtained using the mold. The novel compound is represented by Formula (1). The silicone-dissolvative cleaner contains (A) a silicone surfactant represented by Formula (1); and (B) an organic solvent. Formula (1) is expressed as follows:
##STR00001##
wherein A represents an ionic group selected from the group consisting of a sulfonic ion, a carboxylic ion, and a quaternary ammonium cation; and B represents a counter-ion to A and is selected from an alkali metal ion and a halide ion.
Method for treating a semiconductor device
A sensor array includes a plurality of sensors. A sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array. A method of treating the sensor array includes exposing at least the sensor pad to a wash solution including sulfonic acid and an organic solvent and rinsing the wash solution from the sensor pad.
DEFOAMING COMPOSITIONS FOR DETERGENTS
Effective defoamer compositions contain two different aryl-substituted organopolysiloxanes and filler particles, and show high defoaming capability.