Described herein is an article of manufacture and a method of manufacturing said article, where the article of manufacture includes: a substrate including a webbing; and a varnish layer including an encapsulated fragrance composition applied to at least one surface of the substrate.

Cleaning compositions may include a mix of enzymes that include dispersins and proteases. Said compositions may be used in cleaning processes and/or for deep cleaning of organic stains, and for removal or reduction of components of organic matter.

A method of depositing bacterial spores on a moisture-wicking synthetic fabric, includes contacting the fabric with an aqueous liquor comprising at least 1×10.sup.2 CFU/l of the aqueous liquor, of bacterial spores wherein the aqueous liquor is substantially free of fabric conditioning agent.

A low-viscosity liquid detergent composition comprising an antifoam and a non-ionic surfactant.

A method of making a spray-dried laundry detergent particle, wherein the method includes the steps: (a) forming an aqueous laundry detergent slurry, wherein the slurry includes: (i) from 1 wt% to 40 wt% anionic detersive surfactant; (ii) from 0.1 wt% to 3.5 wt% polyepoxy succinic acid polymer; and (iii) from 10 wt% to 80 wt% water, and (b) spray drying the slurry formed in step (a) to form a spray-dried laundry detergent particle.

Non-fluorocarbon compositions for providing enhanced fluid repellency on various surfaces, including for laundry treatments in a finishing step of a laundry process, are disclosed. Non-fluorocarbon laundry treatment compositions and compositions including the non-fluorocarbon chemistries and a substrate surface are also disclosed along with methods of using the same in a laundry application.

Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.

Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.

A device and method for applying a material to a hard surface. The device has a sensor and one or more applicator nozzles. The device further includes a reservoir for containing a material to be deposited, and a CPU. The method includes providing information from the sensor about the surface to the CPU, which uses the information to identify where the material is to be deposited and/or how much to deposit.

Methods of cleaning waxy, oily and/or greasy soils, including lipsticks and lip gloss, are disclosed. Methods of removing lipstick and lip gloss stains in laundry applications are disclosed through application of alkaline cleaning compositions comprising branched polyamines.