Patent classifications
C11D3/3902
Cleaning composition and cleaning method for component of semiconductor manufacturing process chamber
Provided is a cleaning composition for a component of a semiconductor manufacturing process chamber including: a foaming agent; an oxidizing agent; and an acidic compound, in which a value of (Number of moles of the acidic compound contained in the cleaning composition?acid valence of the acidic compound)/(Number of moles of the foaming agent contained in the cleaning composition?Base valence of the foaming agent) is more than 0.1 and less than 1.5.
Solid laundry detergent for restaurant soils
The invention relates to solid detergents for cleaning restaurant soils and methods of making and using the same. Embodiments of the invention can include solid cleaning compositions having an alkalinity source comprising an alkali metal carbonate, a surfactant system comprising an anionic surfactant and a nonionic surfactant, a water conditioning agent, and water. Embodiments of the invention can have a pH between about 7 and about 11, and are suitable for removing restaurant soils, including, synthetic grease, animal grease, and proteinaceous soils.
PEROXIDE-BASED MULTI-PURPOSE CLEANING, DEGREASING, SANITIZING, AND DISINFECTING SOLUTIONS AND METHODS FOR PREPARING THE SAME
A cleaning solution including: a primary solvent; a secondary solvent, wherein the secondary solvent is at least partially miscible with the primary solvent; an oxidizing agent, wherein the oxidizing agent includes a peroxide; a chelating agent, wherein the chelating agent includes the structure of formula I:
##STR00001##
wherein R.sub.1-R.sub.4 are each independently selected from the group consisting of H; OH; and an alkyl, cycloalkyl, polycycloalkyl, heterocycloalkyl, aryl, alkaryl, aralkyl, alkoxy, alkanoyl, aroyl, alkenyl, alkyl-alkenyl, alcohol, ether, ketone, carboxylic acid, acid halide, acid anhydride, ester, and/or amide group containing approximately 1 to approximately 25 carbon atom(s); and wherein X.sub.1-X.sub.3 are each independently selected from the group consisting of O; S; and Se; a surfactant system, wherein the surfactant system includes a first anionic surfactant, a second anionic surfactant, a third anionic surfactant, and a fourth anionic surfactant; a pH modifier; and an optional amino acid.
TREATMENT COMPOSITION WITH DELIVERY PARTICLES MADE FROM REDOX-INITIATOR-TREATED CHITOSAN
A treatment composition that includes a treatment adjunct and a population of core/shell delivery particles, where the shell is made, at least in part, of chitosan treated with a redox initiator. Related methods of making and using such compositions.
Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor device
Liquid cleaning compositions for removing a titanium nitride hard mask while suppressing damage to copper, a copper alloy, cobalt or a cobalt alloy upon fabricating a semiconductor device, a cleaning method using the same, and a method for fabricating a semiconductor device, which comprise hydrogen peroxide at 1-30% by mass, potassium hydroxide at 0.01-1% by mass, aminopolymethylene phosphonic acid at 0.0001-0.05% by mass, a compound having a group 13 element at 0.00005-0.5% by mass, and water.
MATERIAL CONTAINING SOLID BLEACHING AGENT, AND DETERGENT COMPOSITION
A stabilized solid bleaching agent which has good solubility in water without undergoing the occurrence of foaming and without generating residues has been demanded. The present invention provides a stabilized solid-bleaching-agent-containing material having a coating layer formed therein, wherein the coating layer contains at least one component selected from the group consisting of an alkali metal salt of an aromatic carboxylic acid, an alkali metal salt of a non-cyclic dicarboxylic acid, an alkali metal salt of a non-cyclic monocarboxylic acid having 1 to 7 carbon atoms and mixtures thereof.
AMBIENT MOISTURE-ACTIVATED HARD SURFACE TREATMENT POWDER
Ambient moisture-activatable surface treatment powders containing persalt, positively charged phase transfer agent and alkaline pH buffering may be activatable without the addition of liquid. Some ambient moisture-activatable surface treatment powders are substantially free of bleach activators and/or chlorine. Methods of use of ambient moisture activatable powders include applying them to the surfaces to be treated.
Use of activator complexes to enhance lower temperature cleaning in alkaline peroxide cleaning systems
The present invention provides for the use of activator complexes to enhance lower temperature cleaning in alkaline peroxide cleaning systems. Compositions including at least one of an activator complex, an active oxygen source, and a source of alkalinity are applied to the surface to be cleaned at temperatures between about 5 C. and about 50 C. The methods and compositions of the present invention provide for enhanced soil removal with reduced energy, water, and chemistry consumption.
Hard surface cleaning composition
A composition for use as a hard surface cleaner, sanitizer and/or disinfectant is disclosed. The composition according to one embodiment comprises an arylsulfonic acid, a source of peroxide, an effective amount of a stabilizer and water. A method is provided of cleaning, disinfecting and/or sanitizing a hard surface, the method comprising providing the composition, providing a surface which requires cleaning and applying the composition onto the surface for a duration of time sufficiently long enough to destroy micro-organisms present on the surface.
METHOD FOR OFF-LINE CLEANING OF COOLING TOWERS
A method of cleaning a cooling water system is disclosed. The method may include contacting a cooling tower fill with a composition that may include a surfactant and an additive selected from an oxidizing agent, an acid, and any combination thereof when the cooling water system is off-line. The method may include contacting a deposit in the cooling tower fill with the composition. The oxidizing agent may be hydrogen peroxide, sodium hypochlorite, chlorine dioxide, ozone, sodium hypobromite, sodium or potassium permanganate, or any combination thereof. The surfactant may include a C.sub.8-C.sub.10 alkyl polyglycoside and a C.sub.10-C.sub.18 alkyl polyglycoside.