A description is given of compositions comprising a) one or more substances selected from the group consisting of hydrogen peroxide and hydrogen peroxide donor substances, b) water, c) one or more polymers having thickening properties and d) one or more substances selected from the group consisting of hydroxypyridones and salts thereof. The compositions are notable more particularly for their advantageous shelf lives.

The invention provides to a powdered composition of additives and a method of use thereof for increasing the visibility, potency and coverage of disinfectant solutions, such as bleach.

Systems and methods for using solid high-level disinfection chemistries to producing disinfectant solutions. In an embodiment, an apparatus comprises: a first container and a second container. The first container is configured to receive water, sodium percarbonate and tetraacetylethylenediamine. The water, the sodium percarbonate, the tetraacetylethylenediamine react within the first container to produce a mixture comprising peroxyacetic acid. The second container is in fluid communication with the first container, wherein the second container is configured to receive an acid and the mixture. The mixture and the acid mix in the second container to produce a disinfectant solution having a pH between 5.0 and 7.0.

A method of cleaning a cooling water system is disclosed. The method may include contacting a cooling tower fill with a composition that may include a surfactant and an additive selected from an oxidizing agent, an acid, and any combination thereof when the cooling water system is off-line. The method may include contacting a deposit in the cooling tower fill with the composition. The oxidizing agent may be hydrogen peroxide, sodium hypochlorite, chlorine dioxide, ozone, sodium hypobromite, sodium or potassium permanganate, or any combination thereof. The surfactant may include a C.sub.8-C.sub.10 alkyl polyglycoside and a C.sub.10-C.sub.18 alkyl polyglycoside.

A multi-purpose surface cleaning solution includes sodium percarbonate having a chemical formula of 2Na2CO3.3H2O2 that may be selectively provided in a range of concentrations, from 0.001% through 99.997%. In an aqueous solution, sodium percarbonate decomposes and yields soda ash [Na2CO3] and hydrogen peroxide [H2O2], with additional decomposition of hydrogen peroxide to water [H2O] and diatomic oxygen [O2]. The combination of soda ash, hydrogen peroxide, and diatomic oxygen chemically weaken and release the bonds of the contaminants from the surface(s) to which the contaminants have become attached.

A method is used for cleaning heat exchanger systems. The method is performed at a computer system having one or more processors and memory storing one or more programs configured for execution by the one or more processors. The method determines component percentages of a cleaning solution based, at least in part, on operational parameters of a heat exchanger system. The operational parameters include chemical composition of fluids passing through the heat exchanger system and operating temperatures of the fluids passing through the heat exchanger system. The component percentages of the cleaning solution include: (1) hydrogen peroxide, 2-90 wt. %; (2) a complexing agent, 3-30 wt. %; (3) water-soluble calixarene, 0.01-10 wt. %; and (4) water. The complexing agent includes a polybasic organic acid or a sodium salt thereof, or a derivative of phosphorous acid.

The present application is directed to water and surfactant-containing liquid washing or cleaning agents containing a hydrophobic precursor compound in microemulsified form, from which a peroxycarboxylic acid or the salt thereof can be released by UV radiation. Methods for washing textiles and cleaning hard surfaces using such precursor compounds are also included.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

A process for the manufacture of an aqueous composition suitable for physical foaming comprising hydrogen peroxide, peracetic acid in an amount of at least 1 wt % and at least one amine oxide, said process comprising a step of adding at least one fatty acid in an amount of at least 0.1 wt % with regard to the total weight of the composition.

This disclosure relates generally to bleach activator compositions. This disclosure relates more particularly to tetraacetyldiamine and/or triacetyldiamine derivatives and compositions thereof and to their use as bleach activators, and methods for using them as detergents or biocides.