A solvent composition and method for making same is disclosed having a composition between 26 to 90 weight percent propionate, butyrate, or combination thereof and between 10 to 74 weight percent fluorinated solvent blend, wherein the fluorinated solvent blend includes t-DCE. A polymer solvent system is also disclosed incorporating the solvent composition and dissolved polymers, such as SEBS polymers. The solvent composition and polymer solvent system is minimally combustible or preferably nonflammable.

A treatment liquid is a treatment liquid for a semiconductor device, and contains a fluorine-containing compound and a metal ion.

This invention relates to a bleaching composition comprising hypochlorite-based bleach particles and moisture-sensitive particles encapsulating an oil within starch or starch-derivative matrix, the composition being surprisingly stable toward degradation of the starch upon storage.

The invention relates to methods for disinfecting or sanitizing. The invention is also directed to methods for the preparation of certain compounds useful as a disinfectant or sanitizer, such as glucoheptonic acid, chlorhexidine diglucoheptonate, benzalkonium glucoheptonate, and combinations thereof. The invention is still further directed to methods for evaluating a compound for performance in microbial disinfecting or sanitizing.

A cleaning composition for semiconductor substrates, containing an alkaline compound (A), a corrosion inhibitor (B), and water, wherein the alkaline compound (A) is at least one selected from the group consisting of a quaternary ammonium hydroxide (A1) and potassium hydroxide (A2), and the corrosion inhibitor (B) is at least one selected from the group consisting of 4-substituted pyrazoles, potassium tris(1-pyrazolyl)borohydride, 2-(4-thiazolyl)benzimidazole, and halogenated-8-hydroxyquinolines.

A treatment liquid is a treatment liquid for a semiconductor device, containing a fluorine-containing compound, a corrosion inhibitor, and calcium, in which the mass content ratio of the calcium to the fluorine-containing compound in the treatment liquid is 1.0?10.sup.?10 to 1.0?10.sup.?4.

A treatment liquid is a treatment liquid for a semiconductor device, containing a fluorine-containing compound, a corrosion inhibitor, and calcium, in which the mass content ratio of the calcium to the fluorine-containing compound in the treatment liquid is 1.0?10.sup.?10 to 1.0?10.sup.?4.

The present disclosure is directed to non-corrosive cleaning compositions that are useful, e.g., for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.

An acyclic fluorinated compound of formula (I) is amine-containing acyclic hydrofluoroethers. The acyclic fluorinated compound is useful as heat transfer, solvent cleaning, fire extinguishing agents and electrolyte solvents and additives.

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The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.