An azeotropic composition a formulated with 1,1,1,3,3,3,-hexafluoro-2-methoxypropane and a second component selected from the group consisting of isopropyl alcohol, ethanol, methanol, and trans-1,2-dichloroethylene. The azeotropic composition exhibits a substantially constant boiling point at a constant pressure and is useful for various cleaning and degreasing applications.

To provide a cleaning composition which is suitable for cleaning precision machinery parts and exhibits a small environmental burden as well as excellent safety and economic efficiency.

A cleaning composition including: a component A, the component A being a hydrofluorocarbon, a hydrofluoroether, a hydrofluoroolefin, or a hydrochlorofluoroolefin; a component B, the component B being a hydrofluorocarbon, a hydrofluoroether, a hydrofluoroolefin, or a hydrochlorofluoroolefin having a higher boiling point than the component A; and a component C, the component C being an aqueous organic solvent, wherein the cleaning composition is non-azeotropic.

This invention relates to a bleaching composition comprising hypochlorite-based bleach particles and moisture-sensitive particles encapsulating an oil within starch or starch-derivative matrix, the composition being surprisingly stable toward degradation of the starch upon storage.

This invention relates to a bleaching composition comprising hypochlorite-based bleach particles and moisture-sensitive particles encapsulating an oil within starch or starch-derivative matrix, the composition being surprisingly stable toward degradation of the starch upon storage.

An azeotropic composition a formulated with 1,1,1,3,3,3,-hexafluoro-2-methoxypropane and a second component selected from the group consisting of isopropyl alcohol, ethanol, methanol, and trans-1,2-dichloroethylene. The azeotropic composition exhibits a substantially constant boiling point at a constant pressure and is useful for various cleaning and degreasing applications.

A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a cleaning solution after cleaning the substrate and decomposition of a resin at a bottom of the pattern, and capable of removing the cleaning solution with good efficiency without using a specific device.

A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a cleaning solution after cleaning the substrate and decomposition of a resin at a bottom of the pattern, and capable of removing the cleaning solution with good efficiency without using a specific device.

The present disclosure is directed to non-corrosive cleaning compositions that are useful, e.g., for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.

The present disclosure is directed to non-corrosive cleaning compositions that are useful, e.g., for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.

The present invention comprises chlorinated and non-chlorinated alkaline cleaning compositions for removal of proteinaceous and fatty soils at low temperature, i.e. less than 120 F., with little or no deleterious affect on cleaning performance. According to the invention, applicants have found that adding additional alkalinity makes protein removal more difficult and reducing the amount of alkalinity actually improves performance. According to the invention optimized combinations of chlorine and alkalinity components for low temperature cleaning as well as a surfactant system optimized for low temperature fatty soil removal are disclosed.