A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C.sub.3-C.sub.6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Lipophilic super-absorbent swelling gels have been developed that will not only absorb the oil and grease from these machine parts, but will also act as an automated sweeper due to the self-generating mechanical force of the gel. An octadecylacrylate-co-ethylene glycol dimethacrylate (ODA-co-EGDMA) tetraalkylammonium tetraphenylborate lipophilic polyelectrolyte gel (EG-18) and poly(stearylacrylate-co-ethylene glycol dimethacrylate) (SA-co-EGDMA) neutral gel (NG-18) were evaluated for swelling and oil sorption capacity. NG-18 and EG-18 gels removed particulate contaminants and absorbed oils and grease on metal and non-metal surfaces without causing abrasion. The gels are also recyclable. The cleaning ability of the gels was compared with the standard solvent cleaner trichloroethylene (TCE) following ASTM G122-96(2008) test methods and MIL-PRF-680B procedure with MIL-PRF-10924 test grease. Polymer gel cleaners exhibited analogous extent and rate of cleaning as the TCE. These recyclable superabsorbent polymer cleaners will allow drastic reduction in the use of VOC containing solvents and HAP release.

The present invention relates to the installation of floorcovering articles on chemically abated flooring surfaces and the composite article resulting therefrom. More specifically, the invention relates to a process for chemical removal of mastic, putty and/or paste material from a flooring surface. The process includes applying abatement chemical to the mastic material on the flooring surface to soften the mastic material and cause it to physically separate and release from the flooring surface, removal of the mastic material and abatement chemical, and the subsequent application of a barrier coating to the flooring surface. The barrier coating reduces and/or eliminates the migration of residual abatement chemicals into floorcovering articles thereinafter installed on the chemically abated flooring surface. The resulting composite article is comprised of a chemically abated flooring surface containing pores, at least one abatement chemical in said pores, a polymer-containing barrier material, and a floorcovering article.

Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %. hydroxide based on a total weight of the cleaning composition and deionized water.

A treatment liquid for a semiconductor device contains an organic alkali compound, a corrosion inhibitor, an organic solvent, Ca, Fe, and Na, in which each of the mass ratio of the Ca, the mass ratio of the Fe, and the mass ratio of the Na to the organic alkali compound in the treatment liquid is 10.sup.—12 to 10.sup.−4. A method for washing a substrate and a method for removing a resist use the treatment liquid.

A detergent composition is a detergent composition for removing temporary adhesive containing a silicone compound that is present on a substrate. The detergent composition contains: (A) an organic solvent: 75 to 99 parts by mass; (B) water: 0 to 5 parts by mass; and (C) an ammonium salt: 1 to 20 parts by mass (where (A)+(B)+(C)=100 parts by mass). The organic solvent does not contain an organic solvent having a hydroxy group and contains, in 100 parts by mass of the organic solvent, 50 parts by mass or more of an organic solvent having a heteroatom. The ammonium salt contains at least one kind of a hydroxide ion, a fluoride ion, and a chloride ion.

The invention relates to compositions for removing nail polish comprising a solvent and a high load of colorant, preferably between 0.5 wt % and 5.0 wt %. Preferably, the composition has an absorption peak in a range between 460 nm and 600 nm, and a normalized extinction of at least 0.5 for at least one wavelength in the range when measured in an optically transparent solvent via spectrophotometer and across 1 cm path length in a ratio of 1:8 composition to optically transparent solvent. Methods of removing nail polish are also provided.

This invention relates to a photoresist stripper composition. The photoresist stripper composition according to the present invention comprises at least one choline compound; at least one polar aprotic solvent; and water; the weight percentage of the choline compound is from 2.5 to 50%, preferably from 5 to 50%, more preferably from 7 to 30%, and most preferably from 9 to 18% by weight based on the total weight of the composition. The photoresist stripper composition according to the present invention exhibits excellent photoresist cleaning performance and low etching to the substrate.

In an embodiment a solvent composition can comprise, based on the total volume of the solvent composition, 10 to 95 volume percent of a first solvent, wherein the first solvent has Hansen solubility parameters of: 15 MPa.sup.0.5≤δ.sub.D≤17 MPa.sup.0.5, 4≤δ.sub.P≤10.5 MPa.sup.0.5, and 7≤δ.sub.H≤10 MPa.sup.0.5; 5 to 95 volume percent of a second solvent, wherein the second solvent has Hansen solubility parameters of: 16 MPa.sup.0.5≤δ.sub.D≤17.5 MPa.sup.0.5, 0≤δ.sub.P≤3 MPa.sup.0.5, and 0≤δ.sub.H≤3 MPa.sup.0.5; and 0 to 85 volume percent parachlorobenzotrifluoride; wherein the amounts of the first solvent, the second solvent, and parachlorobenzotrifluoride sum to at least 85 volume percent. The first solvent can comprise methyl acetate, acetone, dimethyl carbonate, ethyl acetate, n-butylamine, propyl acetate, tetrahydrofuran, or a combination thereof. The second solvent can comprise cyclohexene, cyclohexane, cyclopentane, methylcyclohexane, or a combination thereof. The solvent compositions are particularly useful in an adhesive composition. An adhesive composition includes the solvent composition, a rubber, and a tackifying resin. A method of bonding two surfaces is also described.

Provided therefore herein is a novel acidic fluoride activated cleaning chemistry. The present invention includes novel acidic fluoride activated, unique organic-solvent based microelectronic selective etchant/cleaner compositions with high metal nitride etch and broad excellent compatibility, including tungsten (W) and low-k. It does not use W-incompatible oxidizers, such as hydrogen peroxide or particle-generating corrosion inhibitors.