The present invention provides a baking machine, comprising: a machine body; an ingredient pack placement area arranged on the machine body, wherein the machine body is provided with an ingredient pack inlet for placing an ingredient pack into the ingredient pack placement area; a pack-breaking mechanism arranged on the machine body and configured to cut open the ingredient pack; an pack extruding mechanism arranged on the machine body and configured to extrude ingredients from the ingredient pack; and a cooking mechanism arranged on the machine body and configured to receive the ingredients extruded from the ingredient pack and to cook them. When using the baking machine of the present invention to make waffles, users simply need to place the ingredient pack into the ingredient pack placement area, and the baking machine will complete the automatic production process of pack-breaking, ingredient extrusion, and cooking, thereby significantly reducing cooking time.

The present invention provides a baking machine, comprising: a machine body; an ingredient pack placement area arranged on the machine body, wherein the machine body is provided with an ingredient pack inlet for placing an ingredient pack into the ingredient pack placement area; a pack-breaking mechanism arranged on the machine body and configured to cut open the ingredient pack; an pack extruding mechanism arranged on the machine body and configured to extrude ingredients from the ingredient pack; and a cooking mechanism arranged on the machine body and configured to receive the ingredients extruded from the ingredient pack and to cook them. When using the baking machine of the present invention to make waffles, users simply need to place the ingredient pack into the ingredient pack placement area, and the baking machine will complete the automatic production process of pack-breaking, ingredient extrusion, and cooking, thereby significantly reducing cooking time.

A method for making a plurality of wafer bodies is described, wherein two wafer sheets are mutually coupled so that respective parts are united together to form the wafer bodies, and wherein, subsequently, the united parts are separated from the mutually coupled wafer sheets. The method is characterized in that it involves the use of wafer sheets provided with coupling formations for guaranteeing a correct mutual positioning of the wafer sheets.