According to an embodiment, semiconductor manufacturing equipment includes a processing chamber for processing a substrate on which a photoresist film is formed, a stage configured to support the substrate, an annular edge ring configured to enclose the substrate, an annular guard ring configured to cover a circumferential edge of the substrate from above, and a conveyor configured to convey at least the guard ring, in which the guard ring is configured to have an inner circumferential end located between an outer circumferential end of the substrate supported on the stage and an outer circumferential end of the photoresist film.