Provided is a semiconductor module including a stacked substrate in which a plurality of wiring layers are stacked, and a plurality of semiconductor devices mounted on a first surface of the stacked substrate, wherein the plurality of wiring layers have a first wiring layer having a high-potential wiring to which a high potential is applied, a second wiring layer having a low-potential wiring to which a low potential is applied, and a third wiring layer having a connection wiring which connects the plurality of semiconductor devices mounted on the first surface of the stacked substrate to each other, and the high-potential wiring and the low-potential wiring are at least partially overlapped with each other in a stack direction.

Provided is a semiconductor module including a stacked substrate in which a plurality of wiring layers are stacked, and a plurality of semiconductor devices mounted on a first surface of the stacked substrate, wherein the plurality of wiring layers have a first wiring layer having a high-potential wiring to which a high potential is applied, a second wiring layer having a low-potential wiring to which a low potential is applied, and a third wiring layer having a connection wiring which connects the plurality of semiconductor devices mounted on the first surface of the stacked substrate to each other, and the high-potential wiring and the low-potential wiring are at least partially overlapped with each other in a stack direction.

An apparatus and system are described to provide thermal management in electronic devices. An apparatus includes a substrate, a Kriisa current source disposed on the substrate, and a heat source to which the Kriisa current source is thermally and electrically coupled to provide cooling of the heat source simultaneously with current to the heat source or a separate load.

An apparatus and system are described to provide thermal management in electronic devices. An apparatus includes a substrate, a Kriisa current source disposed on the substrate, and a heat source to which the Kriisa current source is thermally and electrically coupled to provide cooling of the heat source simultaneously with current to the heat source or a separate load.