A method for fabricating a semiconductor structure is provided. The method includes providing a plurality of chip regions on a substrate. The method includes forming a plurality of scribe line regions among the chip regions on the substrate. The scribe line regions each include a testing region having a plurality of testing patterns and a dicing region around the test region. The dicing region has a dummy band adjacent to the testing region, and a plurality of dummy patterns are formed in the dummy band and electrically isolated from the testing patterns. The method also includes separating the chip regions along the dicing region of the scribe line regions.