A bonding structure of a semiconductor package device that physically and electrically connects between a semiconductor chip and a package substrate or between a package substrate and a board, the bonding structure includes a solder; a main pad that faces the solder; and an electrically conductive support structure that is connected between the solder and the main pad, the electrically conductive support structure including a sub pad bonded to the solder, the sub pad being spaced apart from the main pad and facing the main pad, and at least one leg extending from the sub pad to the main pad.