A fan-out type packaging method includes: preparing a carrier substrate, where front and back sides of the carrier substrate are respectively provided with removable structures, forming redistribution layers on the front and back sides of the carrier substrate; mounting chips on the front and back sides of the carrier substrate; removing the carrier substrate and performing cutting to obtain a packaged chip. The present disclosure adopts a packaging process involving simultaneous processing on both sides, forming a symmetrical structure on the front and back sides. This may offset bending, dimensional instability, and other phenomena caused by performance differences between multilayer polymer materials and metal materials; the pre-redistribution layer fan-out packaging process adopted by the present disclosure may address precision issues of high-density wiring fan-out packaging. Additionally, the dual-sided structure may effectively offset warping caused by multilayer wiring.