A packaged module can include a packaging substrate having first and second side with a plurality of layers therebetween in a printed circuit board configuration and having a thickness that is less than 200 m, and a first-side portion including a first component mounted on the first side of the packaging substrate and a first mold structure implemented to at least partially encapsulate the first component. The packaged module can further include a second-side portion including a second component mounted on the second side of the packaging substrate and a plurality of conductive mounting structures. The second-side portion can further include a second mold structure implemented to at least partially encapsulate the second component, with the second mold structure further encapsulating the conductive mounting features while providing respective exposed mounting surfaces of the conductive mounting features.

A semiconductor module includes a first semiconductor chip including a first surface and a second surface parallel to a first direction and a second direction, a sub-semiconductor cube including a second semiconductor chip and a logic chip electrically connected to the second semiconductor chip stacked in the first direction, and a semiconductor cube arranged on the second surface, wherein the logic chip includes a plurality of first inductors arranged parallel to a third direction perpendicular to the first direction and the second direction, the first semiconductor chip includes a plurality of routers and a plurality of second inductors arranged parallel to the second surface, a plurality of circuits in the first semiconductor chip are electrically connected using the plurality of routers, and the logic chip and the first semiconductor chip are configured to be able to communicate contactlessly using the plurality of first inductors and the plurality of second inductors.