Patent classifications
H
H10
H10W
90/00
H10W90/762
MICROSTRUCTURED IC CHIP
20260101812
·
2026-04-09
·
An IC chip. The IC chip has an IC substrate, at least one IC functional layer on the substrate, and an etching hole that penetrates the IC functional layer from an outer side through to the substrate. A metal seal is arranged between a region of the IC functional layer and the etching hole.