The present invention relates to a systems and methods for improved removal of one or more species in a process stream, such as combustion product stream formed in a power production process. The systems and methods particularly can include contacting the process stream with an advanced oxidant and with water.

The present disclosure relates to a method for treating exhaust gas including a plasma reaction operation of reacting exhaust gas containing a volatile organic compound (VOC) with low-temperature plasma to generate exhaust gas containing a VOC-derived intermediate, and a combustion operation of combusting the exhaust gas containing the VOC-derived intermediate to produce carbon dioxide and water.

The present disclosure relates to a method for treating exhaust gas including a plasma reaction operation of reacting exhaust gas containing a volatile organic compound (VOC) with low-temperature plasma to generate exhaust gas containing a VOC-derived intermediate, and a combustion operation of combusting the exhaust gas containing the VOC-derived intermediate to produce carbon dioxide and water.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

An abatement system for pyrophoric chemicals where the materials are captured or controlled by a hazard volume and fed to a vaporizer in an oxygen deprived environment. Materials are heated until vaporized while mixed with nitrogen. The mixture exits the system through a reaction column. The system is monitored by oxygen sensors, smoke detectors and temperature sensors.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

A gas treatment device that treats a gas to be treated, including oxygen, introduced at a gas inlet and that exhausts a treated gas at a gas outlet, the gas treatment device includes: a gas channel that communicates the gas inlet with the gas outlet; a blower that allows the gas to be treated to flow from the gas inlet to the gas outlet; an ultraviolet light source that is disposed in the gas channel and radiates ultraviolet light having a wavelength of 230 nm or less; a filter that is disposed at a side at which the gas outlet is located from the ultraviolet light source in the gas channel, and that adsorbs at least ozone; and a control unit that controls the blower to operate, wherein the control unit controls the blower to start a blowing operation after the ultraviolet light source starts radiating the ultraviolet light.

A gas treatment device that treats a gas to be treated, including oxygen, introduced at a gas inlet and that exhausts a treated gas at a gas outlet, the gas treatment device includes: a gas channel that communicates the gas inlet with the gas outlet; a blower that allows the gas to be treated to flow from the gas inlet to the gas outlet; an ultraviolet light source that is disposed in the gas channel and radiates ultraviolet light having a wavelength of 230 nm or less; a filter that is disposed at a side at which the gas outlet is located from the ultraviolet light source in the gas channel, and that adsorbs at least ozone; and a control unit that controls the blower to operate, wherein the control unit controls the blower to start a blowing operation after the ultraviolet light source starts radiating the ultraviolet light.