Patent classifications
B05B14/10
MATERIAL LAYER FORMING DEVICE
The disclosure provides a material layer forming device that can reduce scattering of a raw material blown out from a nozzle to efficiently deposit the raw material on a required portion of a blowout target surface. A fiber layer forming device 1A is a device that blows out short fibers F1 to a blowout target surface (wall surface 4b) and deposits the short fibers F1 on the blowout target surface to form a sheet-like fiber layer F2. The fiber layer forming device 1A includes a nozzle 10 having a blowout region 11c that blows out the short fibers F1. The nozzle 10 further includes a suction region 12c that is close to the blowout region 11c and sucks the short fibers F1 spreading to the outside of the blowout region 11c, among the short fibers F1 blown out from the blowout region 11c.
MATERIAL LAYER FORMING DEVICE
The disclosure provides a material layer forming device that can reduce scattering of a raw material blown out from a nozzle to efficiently deposit the raw material on a required portion of a blowout target surface. A fiber layer forming device 1A is a device that blows out short fibers F1 to a blowout target surface (wall surface 4b) and deposits the short fibers F1 on the blowout target surface to form a sheet-like fiber layer F2. The fiber layer forming device 1A includes a nozzle 10 having a blowout region 11c that blows out the short fibers F1. The nozzle 10 further includes a suction region 12c that is close to the blowout region 11c and sucks the short fibers F1 spreading to the outside of the blowout region 11c, among the short fibers F1 blown out from the blowout region 11c.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
In processing a peripheral edge part of a substrate by a processing liquid, upward scattered liquid droplets may be produced. Accordingly, in the invention, the processing liquid is caused to land on the peripheral edge part of the substrate from a discharge port while the discharge port is positioned to a bevel processing position lower than an eaves part of a cup in a vertical direction with the peripheral edge part of the substrate covered vertically from above by the eaves part. Thus, the eaves part collects upward scattered liquid droplets. As a result, the re-adhesion of the upward scattered liquid droplets to the substrate and the scattering thereof to a surrounding atmosphere are suppressed.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
In processing a peripheral edge part of a substrate by a processing liquid, upward scattered liquid droplets may be produced. Accordingly, in the invention, the processing liquid is caused to land on the peripheral edge part of the substrate from a discharge port while the discharge port is positioned to a bevel processing position lower than an eaves part of a cup in a vertical direction with the peripheral edge part of the substrate covered vertically from above by the eaves part. Thus, the eaves part collects upward scattered liquid droplets. As a result, the re-adhesion of the upward scattered liquid droplets to the substrate and the scattering thereof to a surrounding atmosphere are suppressed.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention includes an upper sealing member fixed near a ceiling wall of a processing chamber and a lower sealing member provided movably in a vertical direction below the upper sealing member. A sealed space is formed by moving down the lower sealing member to a lower limit position where an upper end part of the lower sealing member is aligned or partially overlapped with a lower end part of the upper sealing member in the vertical direction. On the other hand, a conveyance space for carrying the substrate to and from a substrate holder is formed by moving up the lower sealing member to a retracted position above the lower limit position.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention includes an upper sealing member fixed near a ceiling wall of a processing chamber and a lower sealing member provided movably in a vertical direction below the upper sealing member. A sealed space is formed by moving down the lower sealing member to a lower limit position where an upper end part of the lower sealing member is aligned or partially overlapped with a lower end part of the upper sealing member in the vertical direction. On the other hand, a conveyance space for carrying the substrate to and from a substrate holder is formed by moving up the lower sealing member to a retracted position above the lower limit position.
Powder center for supplying a powder coating facility with coating powder, and method for cleaning of the powder center
A powder center for supplying a powder coating facility with coating powder includes a powder reservoir container and a powder conveyor for transporting powder out of the powder reservoir container in the direction of the powder coating facility. Moreover, the powder center includes a container lid that covers the powder reservoir container while powder is being conveyed and can be removed at least partly for the purpose of cleaning the powder reservoir container. Moreover, a cleaning unit for cleaning the powder reservoir container that can be moved from a parking position next to the powder reservoir container into a cleaning position inside the powder reservoir container by a manipulator is provided. Moreover, the powder center includes a controller by which the powder conveyor, the cleaning unit, and the manipulator can be controlled.
Powder center for supplying a powder coating facility with coating powder, and method for cleaning of the powder center
A powder center for supplying a powder coating facility with coating powder includes a powder reservoir container and a powder conveyor for transporting powder out of the powder reservoir container in the direction of the powder coating facility. Moreover, the powder center includes a container lid that covers the powder reservoir container while powder is being conveyed and can be removed at least partly for the purpose of cleaning the powder reservoir container. Moreover, a cleaning unit for cleaning the powder reservoir container that can be moved from a parking position next to the powder reservoir container into a cleaning position inside the powder reservoir container by a manipulator is provided. Moreover, the powder center includes a controller by which the powder conveyor, the cleaning unit, and the manipulator can be controlled.