Patent classifications
B06B2201/70
Somatosensory vibration generating device and method for forming somatosensory vibration
The invention provides a somatosensory vibration generating device comprising: an audio signal receiving module for receiving sound waves of external environmental sounds and converting the sound waves into a first audio frequency signal; a digital-to-analog conversion module for performing digital-to-analog conversion on the first audio frequency signal to generate and output a second audio frequency signal after digital-to-analog conversion; a digital signal processing module for converting the second audio frequency signal output by the digital-to-analog conversion module into a first vibration signal; an operational amplifier for performing gain processing on the first vibration signal and outputting a second vibration signal after gain processing; and at least one tactile transducer at least comprising a vibration element and a tactile transducer; and a frequency of the second audio frequency signal is less than 200 Hz.
CONTINUOUS PROCESSOR UTILIZING QUANTUM FIELD MICRO-VARIABLE PARTICLE INTERACTION
Continuous processing equipment is suitable for use in the preparation of elastomeric compositions from end-of-life tire crumb or other vulcanized rubber starting materials. A reactor includes an outer barrel, a first shaft and a second shaft, and one or more piezoelectric transducer-driven acoustic horns arranged along the outer barrel and penetrating the outer barrel through a series of vibration-isolated ports which traverse a jacket of the outer barrel.
MODULATOR FEEDFORWARD COMPENSATION
An amplifier system may include a first feedback loop coupled between an output of an amplifier to an input of a modulator for regulating an output voltage driven at the output of the amplifier to a first terminal of a load of the amplifier system, a sense resistor for sensing a physical quantity associated with the amplifier, a second control loop coupled to the sense resistor such that the sense resistor is outside of the second control loop, the second control loop configured to regulate a common-mode voltage at a second terminal of the load, and a common-mode feedforward circuit coupled to the sense resistor and configured to minimize effects of a signal-dependent common-mode feedback of the sense resistor.
Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
Identifying mechanical impedance of an electromagnetic load using a two-tone stimulus
A method for identifying a mechanical impedance of an electromagnetic load may include generating a waveform signal for driving an electromagnetic load, the waveform signal comprising a first tone at a first driving frequency and a second tone at a second driving frequency. The method may also include during driving of the electromagnetic load by the waveform signal or a signal derived therefrom, receiving a current signal representative of a current associated with the electromagnetic load and a back electromotive force signal representative of a back electromotive force associated with the electromagnetic load. The method may further include determining amplitude and phase information of the current signal responsive to the first tone and second tone, determining amplitude and phase information of the back electromotive force signal responsive to the first tone and second tone, and identifying parameters of the mechanical impedance of the electromagnetic load based on the amplitude and phase information of the current signal and the amplitude and phase information of the back electromotive force signal.
Ultrasound fingerprint sensing and sensor fabrication
Disclosed are systems, devices and methods for providing fingerprint sensors based on ultrasound imaging techniques in electronic devices and fabrication techniques for producing ultrasound-based fingerprint sensors. In some aspects, an ultrasound fingerprint sensor device includes an intermediate layer coupled to a base chip including an integrated circuit having conducive contacts at a surface of the base chip, the intermediate layer including an insulation layer formed on the base chip and a corresponding array of channeling electrode structures coupled to the conductive contacts and passing through the insulation layer, in which the channeling electrodes terminate at or above a top surface of the insulation layer to provide bottom electrodes; a plurality of ultrasonic transducer elements including an acoustic transducer material coupled to the bottom electrodes; and a plurality of top electrodes positioned on the ultrasonic transducer elements.
Piezoelectric polyvinylidene fluoride material, method for manufacturing same, and fingerprint recognition module
A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.
ELECTRONIC DEVICE
An electronic device (1) includes a touch panel display (2), a speaker (3), and a piezo actuator (4). The speaker (3) outputs a sound based on a first sound signal corresponding to a range of a prescribed frequency or more. The piezo actuator (4) is provided on the touch panel display (2), and is deformed in response to at least one of a second sound signal corresponding to a range of less than the prescribed frequency and a control signal for haptics feedback based on a predetermined vibration pattern to vibrate the touch panel display (2).
Ultrasonic drive and driving method
The present disclosure provides an ultrasonic drive and driving method configured for driving an ultrasonic tool. The ultrasonic drive includes a switch module, a sensing element and a control element. The sensing element senses the voltage and current of the ultrasonic tool and generates a sensing signal accordingly. The control element receives the sensing signal and outputs a control signal. The switch module outputs an ultrasonic signal according to the control signal for controlling the vibration of the ultrasonic tool. When the ultrasonic drive operates a frequency sweep function, the control element determines an operating interval and an operating frequency of the ultrasonic signal. When the ultrasonic drive operates a frequency following function, the control element adjusts the operating frequency according to the sensing signal for keeping the impedance of the ultrasonic tool consistent.
PIEZOELECTRIC SENSOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
A piezoelectric sensor, a manufacturing method thereof and an electronic device are provided. The piezoelectric sensor includes a substrate, an active layer, the active layer being disposed at a side of the substrate: a first electrode, the first electrode being disposed at a side of the active laver a wav from the substrate, and the first electrode including a plurality of sub-electrodes disposed at intervals: a piezoelectric layer, the piezoelectric layer being disposed at a side of the first electrode away from the active layer; and a second electrode, the second electrode being disposed at a side of the piezoelectric layer away from the first electrode. The active layer is configured to be capable of switching between an insulating state and a conducting state, and in the conducting state the active layer is capable of conducting the plurality of sub-electrodes.