A cleaning apparatus for an endless conveyor belt is provided. The cleaning apparatus is operable for a rotary cleaning head to perform a cleaning action on a first section of the endless conveyor belt. In an embodiment of the present invention, the rotary cleaning head comprises a rotating disc assembly. The rotary cleaning assembly is operable for a mobile mount to position the rotary cleaning head into a first cleaning contact position with the endless conveyor belt. To affix the rotary cleaning head assembly to a mount, a connecting portion having a proximal end and a distal end, wherein the proximal end includes a first coupling is provided. Said coupling is capable of making a connection to and disconnecting from the mobile mount, and said distal end capable of making a connection and disconnecting from the rotary cleaning head and adapted for use with the rotary cleaning head.

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

According to one embodiment, a cleaner head includes a first rotor, a second rotor, and a contact surface. The first rotor can be rotationally driven in a state where an outer peripheral surface of the first rotor is in contact with a sheet that includes organic fiber and is formed on a base, and can remove a part of the sheet from the base. The second rotor is arranged next to the first rotor in a direction along a rotation axis of the first rotor, and is rotated together with the first rotor in a state where the second rotor is not in contact with the sheet. The contact surface is in contact with an outer peripheral surface of the second rotor at a position away from the sheet around the rotation axis.

A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

A cleaner comes into contact with a lower-surface center region of a substrate held by a first holder, so that the lower-surface center region is cleaned. The cleaner comes into contact with a lower-surface outer region of the substrate rotated by a second holder, so that the lower-surface outer region of the substrate is cleaned. During cleaning of the lower-surface center region, the second holder is rotated about a vertical axis while not holding the substrate. Alternatively, during cleaning of the lower-surface center region, the gas injector arranged between the cleaner and the second holder injects gas toward the substrate from a first height spaced apart from the substrate by a predetermined distance. Further, during drying of the lower-surface center region, the gas injector injects gas toward the substrate from a second height closer to the substrate than the first height.

A coating method of a board for producing a concrete product and a board coated by the same are proposed. The coating method is advantageous in that the whole surface of a board can be rapidly coated and dried to prevent surface corrosion of the board and to prevent further corrosion on a damaged surface of the board, thus improving the durability of the board and the quality of the produced concrete products. The coating method includes: removing residues existing on an outer surface of the board by blowing high-pressure air to an upper surface and a lower surface of the board for producing a concrete product; coating by spraying coating liquid to the outer surface of the board from which the residues have been removed; and drying the coating liquid by blowing high-pressure air to the outer surface of the board.