According to an aspect of the present disclosure, a heat-resistant coating composition includes: an inorganic filler which is iron (Fe)-based amorphous alloy powder having an amorphous phase and an average particle diameter of 0.5 μm to 15 μm; and a binder, where the coefficient of thermal expansion of the inorganic filler is lower than the coefficient of thermal expansion of the binder.

A photo-curable resin composition for three-dimensional shaping including: a resin component (A) containing a (meth)acrylate compound (A1) represented by General Formula (1)

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(where R.sub.1 is a hydrogen atom or a methyl group, and R.sub.2 is a linear, branched, or cyclic trivalent hydrocarbon group with one to eight carbon atoms which may have three or less heteroatoms), and a urethane (meth)acrylate compound (A2) having two or more radical-polymerizable functional groups; inorganic particles (B); and a photoradical polymerization initiator (C). 40% by mass or more and 90% by mass or less of the (meth)acrylate compound (A1) is contained in the resin component (A). 10% by mass or more and 60% by mass or less of the urethane (meth)acrylate compound (A2) is contained in the resin component (A).

A magnetic material is formed of an aggregate of magnetic particles. When a magnetic particle is rotated by 360/n degrees (n is an any integer equal to or greater than 6) around a gravity center position of the magnetic particle in a planar region, an area of the magnetic particle after the rotation overlaps with an area of the magnetic particle before the rotation by 90% or more. In the planar region, gravity center positions of from nine to eleven magnetic particles are on a band portion in a rectangular shape. For the magnetic particles in the planar region, when a number-based 50% cumulative frequency distribution of maximum lengths in a direction passing through respective gravity center positions is defined as α, a 10% cumulative frequency distribution is equal to or greater than 0.6α, and a 90% cumulative frequency distribution is equal to or less than 1.4α.

Embodiments disclosed are systems and methods for fabricating microchannels in metal. In an embodiments, a method includes providing a first metallic plate having a first surface with an elongated slot recessed therein, providing a second metallic plate having a second surface, interfacing the first surface of the first metallic plate with the second surface of the second metallic plate with the second surface covering the elongated slot to form a microchannel between the first metallic plate and the second metallic plate, thermal bonding the first metallic plate to the second metallic plate to form a metallic body having the microchannel extending therethrough, and infiltrating the metallic body with an infiltrant.

Embodiments disclosed are systems and methods for fabricating microchannels in metal. In an embodiments, a method includes providing a first metallic plate having a first surface with an elongated slot recessed therein, providing a second metallic plate having a second surface, interfacing the first surface of the first metallic plate with the second surface of the second metallic plate with the second surface covering the elongated slot to form a microchannel between the first metallic plate and the second metallic plate, thermal bonding the first metallic plate to the second metallic plate to form a metallic body having the microchannel extending therethrough, and infiltrating the metallic body with an infiltrant.

A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a sacrificial binder and a powder including a shape memory alloy (SMA). The method also may include removing substantially all the sacrificial binder from the fused filament fabricated component to leave an unsintered component; and sintering the unsintered component to join particles of the SMA and form an SMA component.

A method may include fused filament fabricating a fused filament fabricated component by delivering a softened filament to selected locations at or adjacent to a build surface. The softened filament may include a sacrificial binder and a powder including a shape memory alloy (SMA). The method also may include removing substantially all the sacrificial binder from the fused filament fabricated component to leave an unsintered component; and sintering the unsintered component to join particles of the SMA and form an SMA component.

A method of making sintered components made from an iron-based powder composition and the sintered component per se. The method is especially suited for producing components which will be subjected to wear at elevated temperatures, consequently the components consists of a heat resistant stainless steel with hard phases including chromium carbo-nitrides. Examples of such components are parts in turbochargers for internal combustion engines.

A method of making sintered components made from an iron-based powder composition and the sintered component per se. The method is especially suited for producing components which will be subjected to wear at elevated temperatures, consequently the components consists of a heat resistant stainless steel with hard phases including chromium carbo-nitrides. Examples of such components are parts in turbochargers for internal combustion engines.

A polycrystalline diamond construction has a body of polycrystalline diamond (PCD) material; and a cemented carbide substrate bonded to the body of polycrystalline material along an interface. The cemented carbide substrate has tungsten carbide particles bonded together by a binder material, the binder material comprising Co; and the tungsten carbide particles form at least around 70 weight percent and at most around 95 weight percent of the substrate. The cemented carbide substrate has a bulk volume, the bulk volume of the cemented carbide substrate having at least around 0.1 vol. % of inclusions of free carbon having a largest average size in any one or more dimensions of less than around 40 microns.