A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.

Provided are a dissimilar metal welded body and a method of manufacturing the same, capable of preventing galvanic corrosion in a connection portion between dissimilar metals in the dissimilar metal welded body and of sufficient insulation coating being applied even when the insulation coating is applied to the dissimilar metal welded body. The dissimilar metal welded body includes a first member made of a metal containing aluminum as a main component, a second member made of a metal containing copper as a main component, a welded portion formed by pressure-welding an end face of the first member and an end face of the second member to each other, and a metal film that continuously covers a substantially entire part of the first member and at least a part of the second member. The metal film is a film made of a metal containing copper as a main component.

A method for stripping a rod-shaped conductor using laser radiation is provided. The rod-shaped conductor includes an electrically conductive core and a coating that is at least partially transparent to the laser radiation. The method includes traversing the conductor for a first time with at least one laser beam to at least partially reduce transparency of the coating, and traversing the conductor for a second time with the at least one laser beam to at least partially reduce adhesion of the coating.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

A tool for friction bit joining a workpiece material includes a bit with a tapered pin and a non-cutting tip. The bit has a top surface opposite the pin with at least one feature recessed in, or extending from, the top surface and configured to transmit torque to the bit to rotate the bit around a rotational axis.

Structures for a tool surface of a downhole tool are constructed from a metal clay molded in a wet state. The wet state clay is a workable combination that can have a braze alloy grain, a tungsten carbide grain, and a binder. Additional cutting inserts can be embedded in the molded clay. Heat treatment applied to the molded metal clay causing the binder to be combusted and consumed. The braze alloy melts and then cools into a fused state with the tungsten carbide grain therein. The structure can affix to the tool surface of the tool by first being fused and then attached by brazing to the tool. Alternatively, the structure can be positioned in a fusible state adjacent the tool surface. When the heat treatment is applied, the structure fuses together and forms a metallurgical bond with the tool surface of the tool.

The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.

The present invention relates to a method for producing a metal-ceramic substrate. The method has the following steps: providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, wherein the solder material has: a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal; and heating the stack, wherein at least one of the following conditions is satisfied: the high temperature heating duration is no more than 60 min; the peak temperature heating duration is no more than 30 min; the heating duration is no more than 60 min.

A system and method for forming a structure with steep walls (walls having an angle greater than 60° with respect to a level plane) through one or more incremental sheet forming operations is provided. The method includes a workpiece with an inner region and an outer region that are separated by a boundary region. The boundary region includes a plurality of openings and a plurality of connecting elements. The openings are cut into the workpiece using a boundary region cutting tool. A forming tool is configured to operate on the inner region after the boundary region cutting operation has been completed. At least one control unit is in communication with the forming tool. The at least one control unit operates the forming tool to form the structure from the inner region.