In order to provide a laser irradiation system, a method for removing a coating, and a laser irradiation apparatus capable of efficiently removing a coating on a surface of a structure and recovering the removed substance using suction, a laser head (3) is configured from an optical system (4) for irradiating laser beam (30), a suctioning means (33) for suctioning removed matter (60) produced at the point where the laser beam (30) is directed, and an attachment (5) configured to be capable of abutting a surface (20) of a structure, the optical system (4) being operated to scan the irradiation point of the laser beam so as to draw a trajectory of a circle having a radius r1 around the optical axis of the laser beam (30) on a surface substantially perpendicular to the optical axis.

A pressing device for a laser welding apparatus includes an arm member with opposite mounting and pressing ends. A pressing pad at the pressing end has an opening for allowing a laser beam to irradiate a workpiece assembly that is being pressed by the pressing device. The mounting end has a mounting structure for detachably securing the pressing device to the laser welding apparatus. The arm member is shaped to position the opening at a known fixed distance from a laser source of the laser welding apparatus. The pressing pad has a pressing surface on a workpiece-facing side thereof for applying a joining force to the workpiece assembly at a welding location. At least one of the size, shape and smoothness of the pressing surface allows a sliding-contact movement of the pressing surface along a surface of the workpiece assembly during application of the pressing force.

A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.

A shift in position of a laser beam used for welding objects is corrected without need for intervention by a welder. An irradiator performs welding along a welding part of objects to be welded by relatively moving objects to be welded and a nozzle for emitting a laser beam. An arm apparatus movably holds the nozzle while applying a biasing force to the nozzle in a direction toward the welding part such that the nozzle comes into contact with objects to be welded to irradiate the welding part with the laser beam.

A laser stitch welding device, comprising: a laser welding assembly (3) configured to release laser beams from a front surface onto plates (5) to be welded that are stacked; a pressing piece (2) for adjusting a spacing between the stacked plates; detecting assembly for detecting a welding parameter of the stacked plates from a back surface; and a controller (1) for adjusting in real time the pressing level of the pressing piece (2) and/or operation parameters of the laser welding assembly (3) based on the welding parameter detected by the detecting assembly. The laser stitch welding device is capable of detecting in real time welding parameters such as back surface temperature and thermal infrared image of welding seams (6) when welding the plates. A control system controls the pressing level of the pressing piece or the operation parameters of the laser welding assembly based on the welding parameters to adjust the welding in a timely manner, thus achieving adaptive and stable control of weld penetration. The present application further provides a welding method for the laser stitch welding device.

A spot welding jig is provided. The spot welding jig presses electrode leads of battery cells to be closely adhered onto a bus bar when spot welding is performed to the electrode leads interposed on the bus bar along a width direction of the electrode leads. The spot welding jig includes a passing portion through which a welding laser passes, and a predetermined number of barriers configured to vertically partition an inner space of the passing portion.

This joining apparatus, which is a joining component manufacturing apparatus, comprises a pressing-force-applying means that applies a pressing force for pressing a second joining part that is formed on a second workpiece toward a first joining part that is formed on a first workpiece. The joining apparatus is provided with a laser light irradiation device that irradiates a site where the first joining part and the second joining part are brought close together with laser light. The pressing-force-applying means and the laser light irradiation device move as an integrated unit along the direction of extension of the first joining part and the second joining part due to a movement device.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

It is an object of the present invention to provide a method of producing a vacuum thermal insulation panel capable of reducing the occurrence probability of poor welding of a metal outer wrapping material. The method of producing the vacuum thermal insulation panels 100, 100A to 100 D, 101, 101A according to the present invention includes a “covering step of covering a core material 110 or 110B with a metal foil 130 or 131” and a “welding step of welding a metal foil portion on an outer side of the core material”, and the core material is at least partially covered with a cover 120, 120A, or 120D at a timing when the covering step is to be started. Note that when the entire surface of the core material is covered with the cover, it is preferable to reduce the inside of the cover to seal the cover before the covering step, and when a part of the core material is covered with the cover, it is preferable to simultaneously reduce a pressure inside the metal foil and a pressure inside the cover to seal the metal foil.

In order to provide a laser irradiation system, a method for removing a coating, and a laser irradiation apparatus capable of efficiently removing a coating on a surface of a structure and recovering the removed substance using suction, a laser head (3) is configured from an optical system (4) for irradiating laser beam (30), a suctioning means (33) for suctioning removed matter (60) produced at the point where the laser beam (30) is directed, and an attachment (5) configured to be capable of abutting a surface (20) of a structure, the optical system (4) being operated to scan the irradiation point of the laser beam so as to draw a trajectory of a circle having a radius r1 around the optical axis of the laser beam (30) on a surface substantially perpendicular to the optical axis.