A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.

A laser irradiation apparatus includes a stage on which a substrate is provided, a laser irradiation unit which irradiates a laser to the substrate on the stage, an image acquiring unit which acquires an image of a predetermined region of the substrate, and a control unit electrically connected to the laser irradiation unit and the image acquiring unit, where the control unit calculates a brightness value corresponding to an average value of grayscale values of the image provided from the image acquiring unit, compares a calculated brightness value with a reference brightness value, and outputs data on performance of the laser based on a result of comparing the calculated brightness value with the reference brightness value.

Embodiments of an ultrashort pulse laser marking apparatus for forming indelible identifiers on discreet consumable articles, and corresponding methods, are disclosed. An ultrashort pulse laser transmission element of the apparatus is configured to transmit a beam of laser energy toward a marking zone to form an optically-readable indelible identifier on discrete consumable articles. The beam may have a pulse duration less than 10 picosecond, and a wavelength of less than 1.5 microns. The consumable articles may comprise a photoreactive pigment configured to undergo a color change upon exposure to the beam of laser energy, and the indelible identifier may be defined by the color change. Alternatively or in addition, the optical readability may be at least in part by way of a primary pattern reflected light intensity being distinguishable from a baseline reflected light intensity or from a secondary reflected light intensity from a viewpoint outward of the article.

Embodiments of an ultrashort pulse laser marking apparatus for forming indelible identifiers on discreet consumable articles, and corresponding methods, are disclosed. An ultrashort pulse laser transmission element of the apparatus is configured to transmit a beam of laser energy toward a marking zone to form an optically-readable indelible identifier on discrete consumable articles. The beam may have a pulse duration less than 10 picosecond, and a wavelength of less than 1.5 microns. The consumable articles may comprise a photoreactive pigment configured to undergo a color change upon exposure to the beam of laser energy, and the indelible identifier may be defined by the color change. Alternatively or in addition, the optical readability may be at least in part by way of a primary pattern reflected light intensity being distinguishable from a baseline reflected light intensity or from a secondary reflected light intensity from a viewpoint outward of the article.

A manufacturing method for a device chip includes a wafer preparation step of preparing a wafer including a base substrate, a laser beam absorbing layer layered on a front surface of the base substrate, and a device layer being layered on the laser beam absorbing layer and having devices formed in respective separate regions demarcated by a plurality of crossing division lines, a device layer dividing step of forming respective division grooves that divide at least the device layer into individual device chips along the plurality of division lines, and a lift-off step of, after the device layer dividing step is carried out, applying a laser beam of such a wavelength as to be absorbed in the laser beam absorbing layer, from the base substrate side, and lifting off a device chip from the front surface of the base substrate.

A manufacturing method for a device chip includes a wafer preparation step of preparing a wafer including a base substrate, a laser beam absorbing layer layered on a front surface of the base substrate, and a device layer being layered on the laser beam absorbing layer and having devices formed in respective separate regions demarcated by a plurality of crossing division lines, a device layer dividing step of forming respective division grooves that divide at least the device layer into individual device chips along the plurality of division lines, and a lift-off step of, after the device layer dividing step is carried out, applying a laser beam of such a wavelength as to be absorbed in the laser beam absorbing layer, from the base substrate side, and lifting off a device chip from the front surface of the base substrate.

Markings for electronic devices are disclosed. Markings are formed through a laser-based process which transforms a colorant in a multilayer structure disposed along an interior surface of a cover. The transformed colorant defines a marking visible along an external surface of the electronic device.

Markings for electronic devices are disclosed. Markings are formed through a laser-based process which transforms a colorant in a multilayer structure disposed along an interior surface of a cover. The transformed colorant defines a marking visible along an external surface of the electronic device.

A laser blast shield for preventing damage to a first wall of a workpiece opposite a second wall being cut by a laser includes a metal substrate having a micro-textured topology and a highly reflective and thermally conductive metal coating deposited over the micro-textured surface to facilitate spreading of residual laser energy penetrating the second surface and absorption of the laser energy throughout the body of the blast shield.

A laser blast shield for preventing damage to a first wall of a workpiece opposite a second wall being cut by a laser includes a metal substrate having a micro-textured topology and a highly reflective and thermally conductive metal coating deposited over the micro-textured surface to facilitate spreading of residual laser energy penetrating the second surface and absorption of the laser energy throughout the body of the blast shield.