A laser patterning apparatus for a three-dimensional object includes a laser generator, a beam expander configured to adjust a size of a laser beam generated by the laser generator, a dynamic focusing module configured to adjust a z-axis focus position of the laser beam passing through the beam expander, a scan head configured to adjust x- and y-axis focus position of the laser beam passing through the beam expander, a shape recognizer configured to recognize a shape of a three-dimensional object, and a controller configured to extract x-, y-, and z-axis data of the three-dimensional object and to control the scan head and the dynamic focusing module, in order to pattern the three-dimensional object with the laser beam.

A nozzle body and a method of forming the nozzle body. The nozzle body includes at least two hollow-cone nozzle geometries. The nozzle body includes an injection molded or a 3D printed thermoplastic material.

A method for producing a nozzle body and a nozzle body. The method includes at least partially processing a nozzle body blank produced by one of an injection molding process or a 3D printing process by laser processing to form the nozzle body. The nozzle body includes a frusto-conical section; at least one nozzle bore having a diameter of less than or equal to 300 μm coupling the frusto-conical section to an outside of the nozzle body; and at least one turbulence channel that is configured to communicate with the frusto-conical section and to taper in a direction toward to the frusto-conical section

A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described. The process includes transmitting a laser beam onto the product surface to remove the material at a cutting point, rotating the product surface relative to the laser beam, and causing the cutting point to move in a radial direction. According to one aspect of the present disclosure, rotation of the platform and radial movement of the laser beam cause the cutting point to move along a spiral path across the product surface.

A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described. The process includes transmitting a laser beam onto the product surface to remove the material at a cutting point, rotating the product surface relative to the laser beam, and causing the cutting point to move in a radial direction. According to one aspect of the present disclosure, rotation of the platform and radial movement of the laser beam cause the cutting point to move along a spiral path across the product surface.

A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

A beam processing apparatus is a beam processing apparatus that irradiates a workpiece with a processing beam, and performs a removal processing of a first part of the workpiece by irradiating a first surface of the workpiece with the processing beam while moving an irradiation position of the processing beam along a first direction, and performs a removal processing of a second part of the workpiece by irradiating a second surface, which is formed at the workpiece by the removal processing of the first part, with the processing beam while moving the irradiation position of the processing beam along the first direction. A moving range of the processing beam for the removal processing of the second part is smaller than a moving range of the processing beam for the removal processing of the first part.

A beam processing apparatus is a beam processing apparatus that irradiates a workpiece with a processing beam, and performs a removal processing of a first part of the workpiece by irradiating a first surface of the workpiece with the processing beam while moving an irradiation position of the processing beam along a first direction, and performs a removal processing of a second part of the workpiece by irradiating a second surface, which is formed at the workpiece by the removal processing of the first part, with the processing beam while moving the irradiation position of the processing beam along the first direction. A moving range of the processing beam for the removal processing of the second part is smaller than a moving range of the processing beam for the removal processing of the first part.

A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.