Patent classifications
B23K26/40
Laser cutting and machining method for plated steel plate, laser cut-and-machined product, thermal cutting and machining method, thermal cut-and-machined product, surface-treated steel plate, laser cutting method, and laser machining head
A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.
Laser cutting and machining method for plated steel plate, laser cut-and-machined product, thermal cutting and machining method, thermal cut-and-machined product, surface-treated steel plate, laser cutting method, and laser machining head
A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.
THROUGH-GLASS VIA-HOLE FORMATION METHOD
A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.
THROUGH-GLASS VIA-HOLE FORMATION METHOD
A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.
METHOD AND SYSTEM FOR MANUFACTURING HYBRID COMPONENT
The present disclosure relates to a system for manufacturing a hybrid component including a first thermal supplier configured to heat a steel plate, a rolling roll for undercut configured to pressurize the steel plate heated by the first thermal supplier, and to form an undercut on one surface of the steel plate, a first molding roll configured to pressurize the steel plate formed with the undercut to mold the steel plate in a shape of a component to be manufactured, a composite material feeder configured to supply a composite material tape to be seated on one surface of the steel plate formed with the undercut through the first molding roll, and a composite material pressurization roll configured to pressurize the steel plate on which the composite material tape is seated.
LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER
A laser processing device includes: a light source configured to output laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a converging lens for converging the laser light output from the space light modulator to an object, and forming a converging spot on the object; a movement unit for relatively moving the converging spot with respect to the object; and a control unit for relatively moving, while setting a position of the converging spot in a Z direction intersecting with an incident surface of the laser light on the object at a first Z position, the converging spot along a line extended in an X direction along the incident surface by controlling at least the space light modulator and the movement unit.
LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER
A laser processing device includes: a light source configured to output laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a converging lens for converging the laser light output from the space light modulator to an object, and forming a converging spot on the object; a movement unit for relatively moving the converging spot with respect to the object; and a control unit for relatively moving, while setting a position of the converging spot in a Z direction intersecting with an incident surface of the laser light on the object at a first Z position, the converging spot along a line extended in an X direction along the incident surface by controlling at least the space light modulator and the movement unit.
METHOD AND APPARATUS OF FORMING ELECTRODE PLATE
Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.
Method for producing a layer of solid material
A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.
Method for producing a layer of solid material
A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.