A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

There is provided a laser processing apparatus that processes a workpiece by irradiation with a laser beam. The laser processing apparatus includes a holding unit including a holding surface that holds the workpiece and a laser irradiation unit that irradiates the workpiece held by the holding unit with the laser beam. The laser irradiation unit includes a laser oscillator, a collecting lens that focuses the laser beam emitted from the laser oscillator, and a foreign matter adhesion preventing unit that prevents adhesion of a foreign matter to the collecting lens.

A system and method of monitoring a powder-bed additive manufacturing process is provided where a layer of additive powder is fused using an energy source and electromagnetic emission signals are measured by a melt pool monitoring system to monitor the print process. The measured emission signals are analyzed to identify outlier emissions and clusters of outliers are identified by assessing the spatial proximity of the outlier emissions, e.g., using clustering algorithms, spatial control charts, etc. An alert may be provided or a process adjustment may be made when a cluster is identified or when a magnitude of a cluster exceeds a predetermined cluster threshold.

An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

A method for thinning a wafer is provided which is related to the field of semiconductor technologies, to resolve problems of a low yield, a complex process, and high preparation costs of a SiC power device. The wafer which may alternatively be understood as a composite substrate, includes a first silicon carbide layer, a dielectric layer, and a second silicon carbide layer that are disposed in a stacked manner. The wafer has a first side and a second side that are opposite to each other, and a side that is of the second silicon carbide layer and that is away from the first silicon carbide layer is the first side of the wafer.

An additive manufacturing system includes an ultrasonic inspection system integrated in such a way as to minimize time needed for an inspection process. The inspection system may have an ultrasonic phased array integrated into a build table for detecting defects in each successive slice of a workpiece and such that each slice may be re-melted if and when defects are detected.

A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.

A device for moving at least one cutting and welding arrangement able to cut, then weld a tail of a first metal strip to a head of a second metal strip, includes at least one first carriage holding at least one welding head. The first carriage is movable over a guide path following a first course across a transverse strip region. At least one second carriage is movable separately from the first carriage and holds a cutting head. The second carriage is movable on a guide path following a second course. The welding head is used exclusively for a welding mode, the second carriage is used exclusively for a cutting mode and the two carriages have parked positions on either side of the tail and head widths of the strips. A welding method which is associated with the device is also provided.