An aluminum alloy brazing sheet has a 3XXX, 1XXX or 6XXX core, an interliner and a 4XXX brazing layer without added Mg. The interliner has Bi and Mg, the magnesium migrating to the surface of the brazing sheet during brazing and reducing the aluminum oxide to facilitate brazing without flux in a controlled inert atmosphere with reduced oxygen.

In a brazing sheet manufacturing method, a cladding slab is prepared by overlaying at least a core-material slab composed of an aluminum material and a filler-material slab composed of an Al—Si series alloy, in which a metal element that oxidizes more readily than Al is included in at least one of the slabs. A clad sheet is prepared by hot rolling this cladding slab, which then has at least a core material layer composed of the core-material slab and a filler material layer composed of the filler-material slab and disposed on at least one side of the core material. Then, a surface of the clad sheet is etched using a liquid etchant that contains an acid. Subsequently, the clad sheet is cold rolled to a desired thickness. In flux-free brazing, such a brazing sheet is capable of curtailing degradation in brazeability caused by fluctuations in dew point and oxygen concentration.

An aluminum alloy brazing sheet has a 3XXX, 1XXX or 6XXX core, an interliner and a 4XXX brazing layer without added Mg. The interliner has Bi and Mg, the magnesium migrating to the surface of the brazing sheet during brazing and reducing the aluminum oxide to facilitate brazing without flux in a controlled inert atmosphere with reduced oxygen.

A wire for gas-shielded arc welding includes, based on a total mass of the wire C: 0.01 mass % or more and 0.10 mass % or less, Si: 0.05 mass % or more and 0.55 mass % or less, Mn: 1.60 mass % or more and 2.40 mass % or less, Ti: 0.05 mass % or more and 0.25 mass % or less, Cu: 0.30 mass % or less, Al: 0.10 mass % or less, P: 0.025 mass % or less, and S: 0.010 mass % or less with the remainder being Fe and inevitable impurities. In addition, the following relationship is satisfied: 0.1≤[Ti]/[Si]≤3.0, where [Si] is the content of Si (mass %) based on the total mass of the wire and [Ti] is the content of Ti (mass %) based on the total mass of the wire.

The invention relates to a method for the dynamic feeding of shielding gas, comprising feeding a shielding gas to a component in a welding operation, sending the temperature of a region of the component; and setting a composition of the shielding gas according to the sensed temperature.

A method for purging air from a structure to be joined by welding by feeding a liquid cryogen to the structure. The liquid cryogen will enter the structure, warm up and enter the gaseous phase very rapidly. The gaseous cryogen will displace the air that is present in the structure out of the structure and reduce the content of oxygen in the structure to about 10 parts per million when welding can begin.

Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

Provided is a flux-cored wire which can be MIG-welded at any welding position using a pure Ar gas as a shielding gas. A flux-cored wire having a flux filled in the outer skin thereof, wherein TiO.sub.2, Al.sub.2O.sub.3, SiO.sub.2 and ZrO.sub.2 are contained in amounts of 4.7 to 8.5% by mass, 0.5 to 3.5% by mass, 0.5 to 2.0% by mass and 0.8 to 3.0% by mass, respectively, and metal oxides are also contained in the total amount of 8.0 to 13.5% by mass all relative to the total mass of the wire, and the amount of a metal fluoride is limited to 0.02% by mass or less (including 0% by mass).

A container for distilled spirits includes a stainless steel body, stainless steel top element and stainless steel bottom element wherein the body, top element and body element are joined together without solder such that the flavor of the distilled spirits therein is preserved. A method of making the container is also disclosed.