A stacked conductance fin assembly, that is connected to a heatpipe and an exhaust fan of a computing device, includes: a plurality of fins that are partially overlapped and stacked in a linear array along a first axis of the stacked conductance fin assembly. Overlapping regions of the plurality of fins form two parallel structural walls along the first axis. The overlapping regions overlap along a second axis of the stacked conductance fin assembly, the second axis being perpendicular to the first axis. Each of the plurality of fins includes: a main surface that extends along the second axis between two outermost ends of the main surface; two walls that extend along the first axis, each wall extending from each of the outermost ends of the main surface, respectively; and two offset walls that extend along the first axis, each offset wall extending from each wall, respectively.

A fill tool system that fills, seals, and inspects a heat pipe array, which includes one or more heat pipes with heat pipe working fluid.

The present invention relates to a method of manufacturing a cooling device using a heat pipe in which, using casting, the heat pipe is embedded inside a housing, and the method includes a filling step in which a predetermined support member is filled inside a pipe to prevent deformation of the pipe by a pressure of a melt being injected into a cavity of a mold that is closeable, a pipe seating step in which the pipe filled with the predetermined support member is seated in the cavity, a melt injecting step in which the melt is injected into the cavity to surround the pipe, a cooling and withdrawing step in which the injected melt is cooled and a molded product is withdrawn, an injecting step in which a working fluid is injected into the pipe through an injection end, and a finishing step in which, after the injecting step, the pipe is sealed.

A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

An assembly structure of a heat pipe and a vapor chamber and an assembly method thereof are provided. The structure includes a vapor chamber, a heat pipe, a porous sintered structure, and a working fluid. The vapor chamber includes a lower housing and an upper housing, a cavity is formed between the upper housing and the lower housing, and the upper housing includes a through hole and a circular wall. The heat pipe includes an opening. The open end of the heat pipe is disposed perpendicularly corresponding to the circular wall and communicates with the through hole. A block portion is formed on the heat pipe close to the opening. The porous sintered structure is formed between the through hole and the block portion. The working fluid is filled into the cavity.

A heat conduction module structure and a method of manufacturing the same are provided. The structure includes a vapor chamber, a heat pipe, a porous sintered structure, and a working fluid. The vapor chamber includes a lower housing and an upper housing. A cavity is formed between the upper housing and the lower housing. The upper housing includes a through hole and a circular wall. The heat pipe includes a first section and a second section. The first section has a greater inner diameter than that of the second section. The first section includes an opening. The heat pipe is arranged to be perpendicular corresponding to the circular wall and communicates with the through hole by means of the opening. The porous sintered structure is formed from the through hole to the first section. The working fluid is filled in the cavity.

A method uses a sheet shaped member to separate two spaces from each other. The sheet shaped member includes a base having a first principal surface and a second principal surface, and a moisture permeable membrane provided on or close to the first principal surface of the base. The first principal surface of the base is arranged in one of the two spaces having a lower water vapor pressure when the two spaces separated from each other by the sheet-like member have different water vapor pressures.

A method of fabricating an electronic component cooling apparatus. In the electronic component cooling apparatus, a cooling tower includes a plurality of heat dissipation plates stacked on each other, and heat pipes extend through portions of the heat dissipation plates in the top-bottom direction. A heat transfer block includes a base having grooves receiving the heat pipes and a cover covering the heat pipes is located on a top surface of an electronic component. The method includes locating the base above the heat pipes and pressing the base to the heat pipes using a press so that the grooves receive the heat pipes, dropping Cu dust produced from the pressing, realigning an assembly of the base and the heat pipes so that the base is located below, and a fourth step of locating the cover above the assembly and pressing the cover to the assembly using the press.