A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

In a method of monitoring a vibratory grinding process, parameters from different parameter groups are detected and evaluated to output a command for operating the vibratory grinding system.

A system for robotic paint repair that can include a consumable abrasive product configured to abrade a substrate, a tool configured to drive the consumable abrasive product to abrade, a backup pad configured to couple with the consumable abrasive product, a robotic device configured to manipulate the tool, a pressure regulating apparatus mountable to the robotic device and configured to apply a desired pressure to the consumable abrasive product, a sensor configured to measure at least one of a rotational velocity of the backup pad or a debris pattern from the substrate that results from abrading, and a pressure controller configured to control the pressure regulating apparatus to apply the desired pressure based upon the at least one of the measured rotational velocity of the backup pad or the measured debris pattern.

A robotic paint repair system that can comprise: a consumable abrasive product configured to abrade a substrate, a tool configured to drive the consumable abrasive product to abrade, a robotic device configured to manipulate the tool and a compliant accessory actuator positioned between the tool and the substrate, wherein the compliant accessory actuator is driven to apply a desired force and a desired stiffness to the consumable abrasive product in response to sensed data collected between the tool and the substrate

A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system also includes an end effector load retriever that receives a current end effector load of an end effector in the robotic grinding system. The system also includes a material removal predictor that, based on the retrieved rotational speed and the end effector road, predicts a material removal rate. The system also includes a setting adjuster that, based on the predicted removal rate, provides a setting adjustment for the robotic grinding system. The setting adjustment alters a mechanical setting of the robotic grinding system. The system also includes a setting communicator that communicates the setting adjustment to the robotic grinding system.

A substrate processing method includes polishing a target surface of a substrate to be polished by moving a polishing brush in a horizontal direction while pressing the polishing brush against the polishing target surface of the substrate which rotates in a horizontal posture around a vertical axis. The polishing is performed while varying a rotation speed of the substrate and a moving speed of the polishing brush such that the rotation speed of the substrate decreases stepwise or continuously and the moving speed of the polishing brush in a radial direction of the substrate decreases stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases.

The present disclosure provides a method of chemical mechanical polish operation and a chemical mechanical polish operation system. The method includes obtaining a first input parameter and a second input parameter, wherein the first input parameter is associated with an additive of a slurry, and the second input parameter is associated with a characteristic of a process apparatus, determining an output parameter associated with the process apparatus based on the first input parameter and the second input parameter, securing a workpiece by a head over a platen in the process apparatus, supplying the slurry with the additive over the platen with the additive configured with the first parameter, and polishing a surface of the workpiece by operating the process apparatus configured with the output parameter.

Provided are a silver article formed using pure silver, which has high Vickers hardness and prohibits the occurrence of metal corrosion and the occurrence of discoloration; and its method. Disclosed are a silver article and its method, wherein the Vickers hardness is adjusted to 60 HV or higher, and when the height of the peak of 2θ=38°±0.2° by an XRD is designated as h1, and that of 2θ=44°±0.4° is designated as h2, h2/h1 is adjusted to 0.2 or greater.

The objective of the present invention is to provide a deburring control device capable of easily identifying the cause of a deburring failure. A deburring control device according to one aspect of the present disclosure controls deburring processing for removing burrs on a workpiece by moving a deburring tool along a ridge line of the workpiece by means of a robot, and is provided with: an offset amount calculating unit for calculating an offset amount between the actual path of the robot and a taught path thereof; a pressing force acquiring unit for acquiring the pressing force of the deburring tool; a rotational speed acquiring unit for acquiring the rotational speed of the deburring tool; a failure detecting unit for detecting a deburring failure, in which the deburring processing could not be performed appropriately, on the basis of the offset amount, the pressing force, and the rotational speed; and a recording unit for recording a failure reason, which is the reason for the failure detecting unit determining the deburring failure, when the deburring failure is detected.