There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

A rock sanding device includes a base, a bottom sanding plate, an adjustable connecting rod, an elastic loader, a connector, a side sanding brush, a top sanding plate, an inner rod, a prong and a drill rod. The top of the drill rod is fixedly connected with the rotating shaft of the external water drilling rig and the external water drilling rig has a water inlet joint to introduce water into the drill rod. The inner rod and drill rod are connected and fixed coaxially, and the bottom of the drill rod is symmetrically welded with four prongs. The rock specimen is placed in the center of the side sanding brush. The top sanding plate and the bottom sanding plate are provided in the top side and bottom side of the rock specimen, respectively.

A rock sanding device includes a base, a bottom sanding plate, an adjustable connecting rod, an elastic loader, a connector, a side sanding brush, a top sanding plate, an inner rod, a prong and a drill rod. The top of the drill rod is fixedly connected with the rotating shaft of the external water drilling rig and the external water drilling rig has a water inlet joint to introduce water into the drill rod. The inner rod and drill rod are connected and fixed coaxially, and the bottom of the drill rod is symmetrically welded with four prongs. The rock specimen is placed in the center of the side sanding brush. The top sanding plate and the bottom sanding plate are provided in the top side and bottom side of the rock specimen, respectively.

An example grinder/polisher system includes: a specimen holder configured to secure a specimen; a platen; an actuator configured to move at least one of the specimen holder and the platen; a sensor configured to detect objects within a field of view of the sensor; and a controller configured to control movement of the actuator and to stop the actuator in response to detection of an object by the sensor while the actuator is moving.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

A grinding apparatus includes: a pair of rotary grindstones, a rotary base rotationally driven around a first rotation axis, a rotary table included in the rotary base, a fixed base rotatably supporting the rotary base, a fixed table included in the fixed base, a plurality of workpiece supporting tables supported on the rotary base and rotationally driven around a second rotation axis, a plurality of workpiece receiving holes vertically passing through an outer edge part of the workpiece supporting tables, a first motor fixed to the fixed base to rotationally drive the rotary table, a plurality of second motors fixed to the rotary base to rotationally drive the workpiece supporting tables, a controller driving the first motor and the plurality of second motors, and a slip ring disposed below the plurality of second motors and conductively connecting between the controller and the plurality of second motors.

A grinding apparatus includes: a pair of rotary grindstones, a rotary base rotationally driven around a first rotation axis, a rotary table included in the rotary base, a fixed base rotatably supporting the rotary base, a fixed table included in the fixed base, a plurality of workpiece supporting tables supported on the rotary base and rotationally driven around a second rotation axis, a plurality of workpiece receiving holes vertically passing through an outer edge part of the workpiece supporting tables, a first motor fixed to the fixed base to rotationally drive the rotary table, a plurality of second motors fixed to the rotary base to rotationally drive the workpiece supporting tables, a controller driving the first motor and the plurality of second motors, and a slip ring disposed below the plurality of second motors and conductively connecting between the controller and the plurality of second motors.

An apparatus for metal-cutting machining of wear-affected bit-head-proximal end regions of bit holders of road milling machines encompasses: a rotary actuator having an output member rotating around an actuator rotation axis; at least one material-removing tool, rotatable around a tool rotation axis, which is coupled or couplable to the output member so as to rotate together; a positioning arbor, extending along an arbor axis, which is embodied for introduction into a bit receptacle opening of a bit holder and which comprises an abutment segment, located radially remotely from the arbor axis and facing away from the arbor axis in a direction having a radial component, which is embodied for abutment against an inner wall of the bit receptacle opening. A material-removing region, populated with cutting edges, of the material-removing tool is arranged between the positioning arbor and the output member.