A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

A cutting tool mechanism 11 for providing a cutting, abrading or grinding action is disclosed. The mechanism 11 has an inner circular part 17 having teeth 19 extending radially outwardly, a surrounding circular part 25 having inner teeth 27 extending radially inwardly. The circular parts 17 and 25 co-operate by engagement their teeth 19 and 27. Rotation of one circular part causes the other to move constrained by the engagement of the teeth in an orbital, oscillatory or impact motion. An input coupling 81 is provided for transmission of rotary motion, and an output coupling 37 is provided to transmit said orbital, oscillatory or impact motion to a blade 13. In further embodiments, the surrounding circular part 25 can be provided with outwardly extending teeth and surrounded by a further outer circular part with inwardly extending teeth, to cooperate with the outwardly extending teeth, to provide more complex orbital, oscillatory or impact motion.

A cutting tool mechanism 11 for providing a cutting, abrading or grinding action is disclosed. The mechanism 11 has an inner circular part 17 having teeth 19 extending radially outwardly, a surrounding circular part 25 having inner teeth 27 extending radially inwardly. The circular parts 17 and 25 co-operate by engagement their teeth 19 and 27. Rotation of one circular part causes the other to move constrained by the engagement of the teeth in an orbital, oscillatory or impact motion. An input coupling 81 is provided for transmission of rotary motion, and an output coupling 37 is provided to transmit said orbital, oscillatory or impact motion to a blade 13. In further embodiments, the surrounding circular part 25 can be provided with outwardly extending teeth and surrounded by a further outer circular part with inwardly extending teeth, to cooperate with the outwardly extending teeth, to provide more complex orbital, oscillatory or impact motion.

A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools.

A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools.

An apparatus for cutting a curved wall of a structure, of the present invention, may comprise; a guide rail mounted on a curved wall of a structure; a chain mounted on the guide rail; a support plate supported by the guide rail so as to be movable by means of a plurality of rollers; a body case coupled to the support plate; a sprocket mounted at the body case so as to rotate while engaged with the chain; a driving motor mounted in the body case so as to rotate the sprocket; a cutting blade rotatably mounted at the front of the body case; and cutting motor mounted in the body case so as to rotate the cutting blade.

An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.

An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.

An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.

A cutting tool includes a blade formed so as to extend in the width direction or length direction of a workpiece; at least one cutting tip formed so as to protrude from the lower portion of the blade so as to cut the workpiece by reciprocating by means of a swinging motion; and a brazing part formed between the blade and the at least one cutting tip so as to silver-braze the blade and the at least one cutting tip. The brazing part includes a first silver solder layer; a metal sheet layer formed on the first silver solder layer and having a melting point that is higher than a silver brazing process temperature; and a second silver solder layer formed on the metal sheet layer.