A die ejector may include an ejector cap, an ejector holder in the ejector cap, a plurality of ejector rods in the ejector holder, wherein the plurality of ejector rods are independently engaged, and a plurality of ejector pins on the plurality of ejector rods. A method of performing die pick-up may include placing a semiconductor die on a die ejector including a plurality of ejector rods and a plurality of ejector pins on the plurality of ejector rods, wherein the plurality of ejector rods are independently engaged, generating an ejector rod configuration so that the plurality of ejector pins have a configuration based on the semiconductor die, advancing the plurality of ejector rods based on the ejector rod configuration so that the plurality of ejector pins contact the semiconductor die, and lifting the semiconductor die off the plurality of ejector pins.