An electronic device includes a fascia manufactured from a shape memory polymer. One or more thermal elements can be disposed adjacent to the fascia or integrated into the fascia. One or more processors can be operable with the one or more thermal elements to detect deformation along at least a portion of the fascia and cause the one or more thermal elements to selectively apply heat to the shape memory polymer along at least a portion of the fascia to reverse at least some of the deformation.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

A matrix material dispersed with one or more susceptor structures can be formed into a feedstock for an additive manufacturing process. The one or more susceptor structures can be excited by an energy field such as an electric field, a magnetic field, an electromagnetic field, or any combination thereof, to produce heat. The heat that is produced can be transferred to the matrix material that surrounds the one or more susceptor structures to provide heat treatment to the matrix material. The heat treatment can improve the material and mechanical properties of three dimensional objects formed from the feedstock.

A matrix material dispersed with one or more susceptor structures can be formed into a feedstock for an additive manufacturing process. The one or more susceptor structures can be excited by an energy field such as an electric field, a magnetic field, an electromagnetic field, or any combination thereof, to produce heat. The heat that is produced can be transferred to the matrix material that surrounds the one or more susceptor structures to provide heat treatment to the matrix material. The heat treatment can improve the material and mechanical properties of three dimensional objects formed from the feedstock.

A bonding method for bonding an adherend with a high-frequency dielectric heating adhesive sheet is provided. The adherend includes a fluorine-containing surface at least containing fluorine on a surface thereof. The high-frequency dielectric heating adhesive sheet includes a high-frequency dielectric adhesive layer including a thermoplastic resin and a dielectric filler. A surface free energy of the high-frequency dielectric adhesive layer is in a range from 15 mJ/m.sup.2 to 30 mJ/m.sup.2. A melting point of the high-frequency dielectric adhesive layer is in a range from 110 degrees C. to 300 degrees C. The bonding method includes bringing the fluorine-containing surface of the adherend into contact with the high-frequency dielectric adhesive layer and applying a high-frequency wave to the high-frequency dielectric adhesive layer to bond the high-frequency dielectric heating adhesive sheet to the fluorine-containing surface.

A bonding method for bonding an adherend with a high-frequency dielectric heating adhesive sheet is provided. The adherend includes a fluorine-containing surface at least containing fluorine on a surface thereof. The high-frequency dielectric heating adhesive sheet includes a high-frequency dielectric adhesive layer including a thermoplastic resin and a dielectric filler. A surface free energy of the high-frequency dielectric adhesive layer is in a range from 15 mJ/m.sup.2 to 30 mJ/m.sup.2. A melting point of the high-frequency dielectric adhesive layer is in a range from 110 degrees C. to 300 degrees C. The bonding method includes bringing the fluorine-containing surface of the adherend into contact with the high-frequency dielectric adhesive layer and applying a high-frequency wave to the high-frequency dielectric adhesive layer to bond the high-frequency dielectric heating adhesive sheet to the fluorine-containing surface.

A resin molding method is capable of reducing the use amount of micropellets and obtaining a resin molded article having required characteristics. A resin molding method includes a disposing step of disposing a preliminary molded body laminated and formed in a three-dimensional shape in a molding die, a filling step of heating and melting the preliminary molded body by an electromagnetic wave transmitted through the molding die and filling the molding die with a molten resin material, and a cooling step of cooling and solidifying the molten resin material in the molding die. In the cooling step, a resin molded article integrated so as to eliminate a lamination interface of the preliminary molded body is formed in the molding die.

A resin molding method is capable of reducing the use amount of micropellets and obtaining a resin molded article having required characteristics. A resin molding method includes a disposing step of disposing a preliminary molded body laminated and formed in a three-dimensional shape in a molding die, a filling step of heating and melting the preliminary molded body by an electromagnetic wave transmitted through the molding die and filling the molding die with a molten resin material, and a cooling step of cooling and solidifying the molten resin material in the molding die. In the cooling step, a resin molded article integrated so as to eliminate a lamination interface of the preliminary molded body is formed in the molding die.

A method of forming a polyolefin-perovskite nanomaterial composite which contains oriented electrically and thermally conductive pathways. The method involves milling a polyolefin with particles of a perovskite nanomaterial, molding to forma composite plate, and subjecting the composite plate to an AC voltage. The AC voltage forms oriented electrically and thermally conductive pathways by partial dielectric breakdown of the composite. The presence of the oriented electrically and thermally conductive pathways gives the polyolefin-perovskite nanomaterial electrical and thermal conductivity and dielectric permittivity higher than the polyolefin alone.

A method of forming a polyolefin-perovskite nanomaterial composite which contains oriented electrically and thermally conductive pathways. The method involves milling a polyolefin with particles of a perovskite nanomaterial, molding to forma composite plate, and subjecting the composite plate to an AC voltage. The AC voltage forms oriented electrically and thermally conductive pathways by partial dielectric breakdown of the composite. The presence of the oriented electrically and thermally conductive pathways gives the polyolefin-perovskite nanomaterial electrical and thermal conductivity and dielectric permittivity higher than the polyolefin alone.